At the AI Investment Summit held in Beijing on September 16, focused on the theme "Deterministic Opportunities in the AI Infrastructure Era," Tang Jia, Chief Analyst for Electronics and New Technology at Caitong Securities Co.,Ltd., attended and moderated a roundtable discussion. In his concluding remarks, Tang highlighted that by 2027, the demand for supernode cabinets from just three domestic CSP (Cloud Service Provider) vendors could reach a scale of 20,000 to 30,000 units. He emphasized that during this process, demand is not a concern.

Tang clarified the distinct nuances between "tight supply" and "supply-demand shortage." He observed that in the first half of this year, mature process nodes saw price increases first, followed by advanced process nodes due to robust demand. Around the transition from Q1 to Q2, advanced packaging also began to see price hikes. The upstream electronic component supply chain, spanning from foundry services to packaging and even sputtering targets, has seen broad-based price increases.

He expressed that High Bandwidth Memory (HBM) is now facing a more severe "supply-demand shortage" compared to the "tight supply" seen in the first half of the year. Tang noted that many domestic chip manufacturers are expected to launch products supporting supernodes from Q3 of this year through early next year. However, whether these companies can secure sufficient HBM supply will become a critical variable significantly impacting their shipment volumes.

The summit was organized by Sina Finance. All session transcripts were compiled from on-site shorthand notes and have not been reviewed by the speakers. Sina's publication of this content is for informational purposes only and does not constitute endorsement of the views expressed or verification of the statements made.