HTSC Announces September 22 Coupon Payment for Its 2025 Sci-Tech Innovation Bond

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Yesterday

HTSC (06886) has issued a formal announcement confirming that the coupon payment for its 2025 Science and Technology Innovation Bond (Tranche 1) will be processed on September 22.

According to the company's statement, the bond, designated as "25 HTSC Sci-Tech Innovation Bond 01A" with the code 342580006.IB on the interbank market, has a total issuance scale of RMB 300 million. The annual interest rate for the current interest period is set at 1.66%, and the scheduled interest payment date is September 22, 2026.

This notification is intended to ensure the smooth execution of the interest distribution process, allowing all eligible investors to receive their coupon payments in a timely manner. HTSC has urged bondholders to verify their account details with their respective custodians ahead of the payment date to avoid any delay.

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