Advanced Technology & Materials (SHE:000969) issued 400 million yuan of three-year science and technology innovation bonds, according to a Wednesday filing with the Shenzhen bourse.
The bonds have a coupon rate of 1.6% and are set to mature Sept. 15, 2029.
China Merchants Bank is the bookrunner and lead underwriter, while Bank of Ningbo is the joint lead underwriter.
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