Suntak Technology Wins Two Land Plots for IC Packaging Substrate Project

MT Newswires Live

Sep 17

Suntak Technology (SHE:002815) subsidiary Jiangsu ProNova Electronics won usage rights for two industrial and commercial land parcels in Kunshan, China, for 21.3 million yuan, according to a Thursday filing with the Shenzhen bourse.

The sites, consist of an industrial plot with an area of 15,608 square meters and worth 5.6 million yuan and a commercial plot with an area of 5,383 square meters worth 15.7 million yuan, will be used for its 1 billion-yuan integrated circuit packaging substrate project.

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