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晶合集成
27.240
+0.580
2.18%
手動刷新
成交量：
61.84萬
成交額：
1,684.42萬
市值：
608.81億
市盈率：
64.69
高：
27.660
開：
26.520
低：
26.520
收：
26.660
52周最高：
37.000
52周最低：
26.000
股本：
22.35億
香港流通股本：
2.27億
量比：
0.47
換手率：
0.27%
股息：
- -
股息率：
- -
每股收益(LYR):
0.421
淨資產收益率：
1.59%
總資產收益率：
0.76%
市淨率：
2.23
市盈率(LYR):
64.69
市銷率:
4.47
資料載入中...
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公司
新聞資訊
公告
異動解讀｜晶合集成盤中上漲3.14%，獲調入港股通標的名單今日生效
行情直击
·
08/07
港股通標的證券名單調入晶合集成，今日起生效
老虎资讯综合
·
08/07
晶合集成(02249.HK)獲調入滬深港通下的港股通標的名單
智通财经
·
08/07
深交所公告，港股通標的證券名單調入晶合集成，自2026年08月07日起生效。
格隆汇
·
08/07
晶合集成(02249.HK)超額配股權獲部分行使 額外籌3.45億元
阿斯达克财经
·
08/06
晶合集成(02249.HK)：部分行使超額配股權、穩定價格行動及穩定價格期結束
智通财经
·
08/06
晶合集成局部行使超額配股權籌資約3.45億港元 H股佔比升至10.16%
公告速递
·
08/06
摩根士丹利在晶合集成的H股好倉比例下降0.31%至7.91%
南方财经网
·
08/06
異動解讀｜晶合集成盤中下跌3.15%，半導體板塊集體走弱拖累個股回調
行情直击
·
08/06
晶合集成更新2026年7月股份變動月報表，股本維持穩定
公告速递
·
08/05
異動解讀｜晶合集成盤中上漲3.17%，半導體板塊集體走強疊加多方機構持續增持
行情直击
·
08/05
晶合集成獲China International Capital Corporation Limited增持71.17萬股 每股作價約28.85港元
新浪港股
·
08/05
晶合集成(02249)股價上升5.025%，現價港幣$29.68
阿斯达克财经
·
08/04
異動解讀｜晶合集成盤中上漲3.33%，半導體板塊集體反彈疊加多方機構持續增持
行情直击
·
08/04
China International Capital Corporation Limited增持晶合集成(02249.HK)390.79萬股 每股作價約28.44港元
智通财经
·
08/03
【IPO月報】7月港股IPO市場冷暖不一 17家企業登陸 7家首日「破發」
金吾财讯
·
08/03
異動解讀｜晶合集成盤中下跌3.08%，半導體板塊延續調整個股普遍承壓
行情直击
·
08/03
晶合集成獲GIC Private Limited增持71.25萬股 每股作價約30.12港元
新浪港股
·
08/03
GIC Private Limited增持晶合集成(02249.HK)71.25萬股 每股作價約30.12港元
智通财经
·
07/31
晶合集成：China International Capital Corporation Limited增持，好倉比例升至23.59%
港股披露
·
07/31
更多
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21:57","pubTimestamp":1786024661,"startTime":"0","endTime":"0","summary":null,"market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.zhitongcaijing.com/immediately.html?type=ganggu","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_zhitongcaijing","symbols":["BK1163","02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1146146947","title":"晶合集成局部行使超額配股權籌資約3.45億港元 H股佔比升至10.16%","url":"https://stock-news.laohu8.com/highlight/detail?id=1146146947","media":"公告速递","labels":["SGX"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1146146947?lang=zh_tw&edition=fundamental","pubTime":"2026-08-06 21:55","pubTimestamp":1786024536,"startTime":"0","endTime":"0","summary":"2026年8月6日，合肥晶合集成电路股份有限公司公告称，整体协调人已于同日部分行使超额配股权，认购股份数为10,886,900股H股，占全球发售项下初步可供认购发售股份总数约5.04%。上述股份的发行价为每股32.30港元，不含1.0%经纪佣金、0.0027%证监会交易征费、0.00015%会财局交易征费及0.00565%联交所交易费。部分行使超额配股权后，公司已发行股本由2,223,758,697股增至2,234,645,597股。未被行使的超额配股权已于2026年8月6日失效。","market":"sh","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"SGX","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2657681887","title":"摩根士丹利在晶合集成的H股好倉比例下降0.31%至7.91%","url":"https://stock-news.laohu8.com/highlight/detail?id=2657681887","media":"南方财经网","labels":["shareholding"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2657681887?lang=zh_tw&edition=fundamental","pubTime":"2026-08-06 17:17","pubTimestamp":1786007844,"startTime":"0","endTime":"0","summary":"南财智讯8月6日电，香港交易所披露信息显示，MorganStanley（摩根士丹利）在晶合集成的H股好仓（L）比例于8月3日从8.22%下降至7.91%。同时淡仓（S）比例从0.03%降至0.02%。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"stock_eastmoney","url":"http://finance.eastmoney.com/a/202608063833936780.html","rn_cache_url":null,"directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://finance.eastmoney.com/a/202608063833936780.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"shareholding","news_rank":0,"length":0,"strategy_id":0,"source":"stock_eastmoney","symbols":["LU0912757837.SGD","LU1162221912.USD","LU1732800096.USD","LU2347655156.SGD","LU1791710582.SGD","BK4504","LU0053666078.USD","LU1363072403.SGD","LU0557290698.USD","MS","LU0795875086.SGD","LU0106831901.USD","BK1163","LU0210528500.USD","LU2264538146.SGD","LU2487616109.SGD","LU0267386448.USD","LU1791710400.SGD","LU1548497426.USD","LU0390134368.USD","LU1244550494.USD","LU1720051017.SGD","LU0006306889.USD","LU0225283273.USD","LU0971096721.USD","LU1668664300.SGD","LU0882574139.USD","BK4516","LU2133065610.SGD","IAI","LU1988902786.USD","LU2357305700.SGD","LU0158827948.USD","LU2023251221.USD","KBWB","LU0795875169.SGD","LU1732799900.SGD","02249","LU2089283258.USD","BK4581","688249","IE00B3S45H60.SGD","LU0098860793.USD","LU2028103732.USD","LU0158827781.USD","BK4534","LU1989772923.USD","LU0320765646.SGD","LU0234570918.USD","IE00BKVL7J92.USD"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1109661565","title":"異動解讀｜晶合集成盤中下跌3.15%，半導體板塊集體走弱拖累個股回調","url":"https://stock-news.laohu8.com/highlight/detail?id=1109661565","media":"行情直击","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1109661565?lang=zh_tw&edition=fundamental","pubTime":"2026-08-06 11:25","pubTimestamp":1785986752,"startTime":"0","endTime":"0","summary":"8月6日，晶合集成盘中下跌3.15%，报31.36港元/股，成交额1301.54万港元。消息面上，半导体板块整体走弱，行业个股普遍承压。同板块中，天数智芯跌5.74%，中芯国际跌4.12%，澜起科技跌3.33%，华虹宏力跌3.18%，兆易创新跌1.48%，板块系统性回调拖累公司股价。海外半导体设备股同样延续调整，应用材料、阿斯麦等前期获利盘持续回吐，全球半导体板块承压氛围向港股传导。此前晶合集成H股连续两日反弹，短期累计涨幅较为明显，今日随板块回落存在技术性修复压力。（以上内容均基于市场公开消息，由程序或算法智能生成，仅作为股价异动提醒，不作为投资建议或交易依据。）","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":"晶合集成盘中下跌3.15%，半导体板块集体走弱拖累个股回调","news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1140321979","title":"晶合集成更新2026年7月股份變動月報表，股本維持穩定","url":"https://stock-news.laohu8.com/highlight/detail?id=1140321979","media":"公告速递","labels":["SGX"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1140321979?lang=zh_tw&edition=fundamental","pubTime":"2026-08-05 17:03","pubTimestamp":1785920636,"startTime":"0","endTime":"0","summary":"合肥晶合集成电路股份有限公司于2026年8月5日发布截至2026年7月31日的股份变动月报。公告显示，本月公司各类股本总数未发生增减变动，股本结构保持稳定。截至2026年7月31日，公司法定注册股本合计2,223,758,697股，每股面值人民币1元；其中H股216,167,000股，A股2,007,591,697股。A股中包含62,088,500股库藏股份，后续将用于员工激励计划或持股计划。公司声明已遵守香港联交所《上市规则》及相关法律要求。本次月报由执行董事兼董事长蔡国智签署。","market":"hk","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"SGX","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1117871544","title":"異動解讀｜晶合集成盤中上漲3.17%，半導體板塊集體走強疊加多方機構持續增持","url":"https://stock-news.laohu8.com/highlight/detail?id=1117871544","media":"行情直击","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1117871544?lang=zh_tw&edition=fundamental","pubTime":"2026-08-05 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Limited增持晶合集成（02249）71.17万股，每股作价28.8473港元，总金额约为2053.06万港元。增持后最新持股数目为5625.16万股，最新持股比例为26.02%。","market":"other","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://finance.sina.com.cn/stock/hkstock/ggscyd/2026-08-05/doc-inimfmyv1501410.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"shareholding","news_rank":0,"length":0,"strategy_id":0,"source":"sina","symbols":["BK0214","EWH","02249","688249","BK1163"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2656896875","title":"晶合集成(02249)股價上升5.025%，現價港幣$29.68","url":"https://stock-news.laohu8.com/highlight/detail?id=2656896875","media":"阿斯达克财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2656896875?lang=zh_tw&edition=fundamental","pubTime":"2026-08-04 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Limited增持晶合集成（02249）71.25万股，每股作价30.1181港元，总金额约为2145.91万港元。增持后最新持股数目约为1146.38万股，持股比例为5.30%。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://finance.sina.com.cn/stock/hkstock/ggscyd/2026-08-03/doc-inikytnr4749837.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"shareholding","news_rank":0,"length":0,"strategy_id":0,"source":"sina","symbols":["BK4104","02249","GIC","BK1163","688249","BK0214","EWH"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2655363101","title":"GIC Private Limited增持晶合集成(02249.HK)71.25萬股 每股作價約30.12港元","url":"https://stock-news.laohu8.com/highlight/detail?id=2655363101","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2655363101?lang=zh_tw&edition=fundamental","pubTime":"2026-07-31 19:12","pubTimestamp":1785496343,"startTime":"0","endTime":"0","summary":null,"market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.zhitongcaijing.com/immediately.html?type=ganggu","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_zhitongcaijing","symbols":["02249","BK1163"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1127921527","title":"晶合集成：China International Capital Corporation Limited增持，好倉比例升至23.59%","url":"https://stock-news.laohu8.com/highlight/detail?id=1127921527","media":"港股披露","labels":["shareholding"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1127921527?lang=zh_tw&edition=fundamental","pubTime":"2026-07-31 17:12","pubTimestamp":1785489155,"startTime":"0","endTime":"0","summary":"根据香港交易所披露，China International Capital Corporation Limited于2026年7月28日以每股均价29.64港元买入晶合集成（02249）H股184.07万股，涉资约5455.83万港元。China International Capital Corporation Limited此次增持前持有晶合集成好仓4915.31万股，占比22.73%；增持后持股量为5099.38万股，好仓比例升至23.59%。原文链接：Hong Kong Exchanges and Clearing Limited","market":"hk","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"shareholding","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0}],"pageSize":20,"totalPage":8,"pageCount":3,"totalSize":158,"code":"91000000","status":"200"}]}}