港股詳情

本頁面由Tiger Trade Technology Pte. Ltd.提供服務

晶合集成

26.820

-0.420-1.54%

成交量：30.38萬

成交額：818.46萬

市值：599.43億

市盈率：63.72

高：27.240

開：27.240

低：26.600

收：27.240

52周最高：37.000

52周最低：26.000

股本：22.35億

香港流通股本：2.27億

量比：0.74

換手率：0.13%

股息：- -

股息率：- -

每股收益(LYR):0.421

淨資產收益率：1.59%

總資產收益率：0.76%

市淨率：2.20

市盈率(LYR):63.72

市銷率: 4.40

資料載入中...

總覽公司新聞資訊公告

晶合集成英文名稱變更獲港註冊處確認證券簡稱及代碼不變

晶合集成(02249)：英文公司名稱變更為「Nexchip Semiconductor Corporation」

新股消息 | 晶合集成(02249)招股結束孖展認購額錄得1645.34億港元超購234.65倍

科創50日內跌幅達1.52%，成分股中，佰維存儲跌4.94%，國博電子跌4.31%，瀾起科技跌3.34%，晶合集成跌3.

科創50日內跌幅達1.03%，成分股中，晶合集成跌6.63%，格科微跌6.47%，生益電子跌5.70%，沐曦股份跌4.7

A股MCU概念板塊異動拉升

科創50日內漲幅達1.00%，成分股中，傳音控股漲7.91%，國博電子漲7.17%，晶合集成漲6.67%，源傑科技漲5.

科創50探底回升翻紅

新股招股 | 晶合集成今起招股，一手入場費3262.57港元

老虎资讯综合

晶合集成(02249)6月30日至7月7日招股擬全球發售2.16億股H股引入集創、璞新科技等基石投資者

晶合集成(688249.SH)：H股發行價格最高不超過每股32.30港元

新股快訊：合肥晶合集成電路（02249）啓動全球發售，最高發售價每股32.30港元

晶合集成獲得實用新型專利授權：「一種半導體薄膜沉積設備」

770億合肥芯片「黑馬」晶合集成衝刺港股IPO：增收不增利，淨利潤大幅下滑62.61%、淨利率不足1%

又一半導體巨頭要登陸港交所了

华尔街见闻

晶合集成通過聆訊：第一季營收29億淨利按年降63% 華勤技術持股11%

新股消息 | 晶合集成(688249.SH)通過港交所聆訊 2025年12英寸晶圓的平均月產量為139千片

晶合集成赴港IPO，專注於12英寸晶圓代工，全球第九！

{"basename":"/hant","ssrTDKData":{"titleTemplate":"%s - 老虎證券","title":"Easy breezy. No more feesies.","description":"Tiger Trade is a mobile trading app offering real time data, low commission fees and a free demo account. Download now to start investing in ETFs, options and the global share market.","keywords":"老虎國際,美股交易,港股交易,交易美股,股票信息,股價,美股行情,美股打新,港股打新,IPO打新,購買美股,全球投資","social":{"ogDescription":"Tiger Trade is a mobile trading app offering real time data, low commission fees and a free demo account. Download now to start investing in ETFs, options and the global share market.","ogImage":"https://c1.itigergrowtha.com/portal5/static/media/og-logo.0a0bd8dc.png","ogUrl":"https://www.thetigerbrokers.com/hant/stock/02249/news?page=8"},"companyName":"老虎證券"},"pageData":{"isMobile":false,"isTiger":false,"isTTM":true,"region":"NZL","license":"TBKIWI","edition":"fundamental","symbol":"02249","isAnalysisPage":false},"__swrFallback__":{"@#url:\"https://hq.skytigris.cn/stock_info/detail/global\",params:#delay:false,,method:\"POST\",data:#items:@#symbol:\"02249\",,,,,undefined,":{"symbol":"02249","market":"HK","secType":"STK","nameCN":"晶合集成","latestPrice":26.82,"timestamp":1789615563701,"preClose":27.24,"halted":0,"volume":303800,"delay":0,"changeRate":-0.015418502202643104,"floatShares":227000000,"shares":2235000000,"eps":0.42093576427024826,"marketStatus":"交易中","change":-0.42,"latestTime":"09-17 11:27:33","open":27.24,"high":27.24,"low":26.6,"amount":8184578,"amplitude":0.023495,"askPrice":26.9,"askSize":8100,"bidPrice":26.72,"bidSize":300,"shortable":0,"etf":0,"ttmEps":0.3718265917720527,"tradingStatus":2,"nextMarketStatus":{"tag":"午間休市","tradingStatus":4,"beginTime":1789617600000},"marketStatusCode":2,"adr":0,"listingDate":1783612800000,"exchange":"SEHK","adjPreClose":27.24,"openAndCloseTimeList":[[1789608600000,1789617600000],[1789621200000,1789632000000]],"volumeRatio":0.741886,"lotSize":100,"spreadScale":0,"tradeCurrency":"HKD","astockBrief":{"symbol":"688249","market":"SH","secType":"STK","nameCN":"晶合集成","latestPrice":35.27,"timestamp":1789615649000,"preClose":35.67,"halted":0,"volume":8244100,"delay":0,"premium":"-34.97"}},"@#url:\"https://hq.skytigris.cn/stock_info/fundamental/all\",params:#delay:false,,method:\"POST\",data:#items:@#symbol:\"02249\",,,,,undefined,":{"symbol":"02249","floatShares":227000000,"roa":"0.76%","roe":"1.59%","lyrEps":0.420936,"volumeRatio":0.741886,"shares":2235000000,"dividePrice":0,"high":27.24,"amplitude":0.023495,"preClose":27.24,"low":26.6,"week52Low":26,"pbRate":"2.20","psRate":"4.40","week52High":37,"institutionHeld":0,"latestPrice":26.82,"committee":-0.928571,"eps":0.42093576427024826,"divideRate":0,"volume":303800,"delay":0,"ttmEps":0.3718265917720527,"open":27.24,"prevYearClose":32.3,"prevWeekClose":28,"prevMonthClose":29.9,"prevQuarterClose":32.3,"fiveDayClose":28.52,"twentyDayClose":30.5,"sixtyDayClose":32.3},"@#url:\"https://hq.skytigris.cn/fundamental/corporate_actions/details/02249\",params:#limit:5,,,undefined,":[{"date":"2026-08-24","symbol":"02249","type":"earning","reportTimeType":"","market":"HK","fiscalQuarterEnding":null,"expectedEps":null,"defaultRemindTime":1787535000000,"name":null,"time":"","dateTimestamp":1787500800000,"actualEps":null}],"@#url:\"https://hq.skytigris.cn/fundamental/dividend/history\",params:#symbol:\"02249\",market:\"HK\",,,undefined,":[],"@#url:\"https://hq.skytigris.cn/fundamental/estimate/recommendation\",params:#symbol:\"02249\",market:\"HK\",delay:false,,,undefined,":{"strongBuy":0,"buy":0,"hold":1,"sell":0,"strongSell":0,"meanLabel":"HOLD","meanPercent":1,"analysts":1,"updateTime":1761926400000},"@#url:\"https://hq.skytigris.cn/hkstock/value_analysis/stock/02249\",params:#withQuantilePoint:true,period:\"5year\",factor:\"peRate\",delay:false,algorithm:1,,,undefined,":{"brief":{"id":"02249","date":"2026-09-16","current":72.494724,"percent":0.156863,"low":115.974975,"twenty":122.117547,"median":135.219047,"eighty":165.274447,"high":204.824229,"avg":143.2167,"sd":22.401847,"marketCap":87348222165.73},"quantilePoints":[{"date":"2026-07-10","current":179.739745,"twenty":182.971603,"median":188.773748,"eighty":195.451502,"marketCap":128382476523.4},{"date":"2026-07-17","current":150.463291,"twenty":166.329542,"median":174.887695,"eighty":189.640662,"marketCap":107853685626.21},{"date":"2026-07-24","current":157.350847,"twenty":156.450404,"median":167.323499,"eighty":184.778404,"marketCap":112816102656.31},{"date":"2026-07-31","current":125.59404,"twenty":142.172814,"median":162.353713,"eighty":181.355674,"marketCap":90218434073.04},{"date":"2026-08-07","current":138.46458,"twenty":133.273801,"median":155.099739,"eighty":173.917284,"marketCap":99656904642.39},{"date":"2026-08-14","current":155.021585,"twenty":133.951849,"median":150.463291,"eighty":169.732564,"marketCap":111714702447.87},{"date":"2026-08-21","current":150.843717,"twenty":134.281621,"median":152.274425,"eighty":169.373402,"marketCap":108944198399.02},{"date":"2026-08-28","current":132.628394,"twenty":132.763402,"median":150.463291,"eighty":169.023765,"marketCap":95509764070.79},{"date":"2026-09-04","current":119.096515,"twenty":128.889758,"median":138.847859,"eighty":167.938299,"marketCap":85799473031.23},{"date":"2026-09-11","current":119.056569,"twenty":124.067333,"median":136.208451,"eighty":166.532178,"marketCap":85886443683.64},{"date":"2026-09-16","current":120.956389,"twenty":122.117547,"median":135.219047,"eighty":165.274447,"marketCap":87348222165.73}],"updateTime":1789610089896},"$inf$@#url:\"https://stock-news.skytigris.cn/v2/news/list\",params:#symbols:\"02249\",pageSize:20,pageCount:8,lang_content:\"cn\",edition:\"fundamental\",,,undefined,":[{"items":[{"id":"1180019641","title":"晶合集成英文名稱變更獲港註冊處確認 證券簡稱及代碼不變","url":"https://stock-news.laohu8.com/highlight/detail?id=1180019641","media":"公告速递","labels":["SGX"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1180019641?lang=zh_tw&edition=fundamental","pubTime":"2026-07-07 20:23","pubTimestamp":1783427017,"startTime":"0","endTime":"0","summary":"合肥晶合集成电路股份有限公司7月7日公告称，公司已完成在香港的英文名称变更程序。香港公司注册处处长于2026年7月6日向公司发出《注册非香港公司变更名称注册证明书》，确认公司英文名称由“Nexchip Semiconductor  Limited”变更为“Nexchip Semiconductor Corporation”。公告指出，此次英文名称更改不影响股东任何权利。英文及中文股份简称分别维持为“NEXCHIP”及“晶合集成”，H股股份代号仍为02249。","market":"sh","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"SGX","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2649417987","title":"晶合集成(02249)：英文公司名稱變更為「Nexchip Semiconductor Corporation」","url":"https://stock-news.laohu8.com/highlight/detail?id=2649417987","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2649417987?lang=zh_tw&edition=fundamental","pubTime":"2026-07-07 20:23","pubTimestamp":1783427012,"startTime":"0","endTime":"0","summary":"智通财经APP讯，晶合集成(02249)发布公告，于2026年7月6日，香港公司注册处处长发出注册非香港公司变更名称注册证明书，确认公司已根据香港法例第622章公司条例第16部变更其名称，现以英文公司名称“Nexchip Semiconductor Corporation”注册。公司于香港的英文公司名称变更后，公司于联交所买卖H股的英文及中文股份简称将维持不变，分别为“NEXCHIP”及“晶合集成”，而H股股份代号将维持不变为2249。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1464343.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["BK0214","02249","688249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2649604966","title":"新股消息 | 晶合集成(02249)招股結束 孖展認購額錄得1645.34億港元 超購234.65倍","url":"https://stock-news.laohu8.com/highlight/detail?id=2649604966","media":"智通财经","labels":["shareholding"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2649604966?lang=zh_tw&edition=fundamental","pubTime":"2026-07-07 14:36","pubTimestamp":1783406209,"startTime":"0","endTime":"0","summary":"智通财经APP获悉，晶圆代工企业晶合集成于2026年6月30日至2026年7月7日招股，最新已结束招股。根据市场消息，晶合集成已获券商借出1645.34亿港元孖展，以公开集资额6.98亿港元计，超购234.65倍。晶合集成拟全球发售2.16亿股H股，其中，香港公开发售占约10%，国际发售占约90%，另有15%超额配股权。每股发售价介乎30至32.3港元，每手100股，一手入场费3262.57港元。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1463992.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"shareholding","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["IPOS","688249","02249","BK0214"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2649608557","title":"科創50日內跌幅達1.52%，成分股中，佰維存儲跌4.94%，國博電子跌4.31%，瀾起科技跌3.34%，晶合集成跌3.","url":"https://stock-news.laohu8.com/highlight/detail?id=2649608557","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2649608557?lang=zh_tw&edition=fundamental","pubTime":"2026-07-07 09:30","pubTimestamp":1783387803,"startTime":"0","endTime":"0","summary":null,"market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.zhitongcaijing.com/immediately.html?type=usstock","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_zhitongcaijing","symbols":["KSTR","02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2649061742","title":"科創50日內跌幅達1.03%，成分股中，晶合集成跌6.63%，格科微跌6.47%，生益電子跌5.70%，沐曦股份跌4.7","url":"https://stock-news.laohu8.com/highlight/detail?id=2649061742","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2649061742?lang=zh_tw&edition=fundamental","pubTime":"2026-07-06 10:21","pubTimestamp":1783304467,"startTime":"0","endTime":"0","summary":null,"market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.zhitongcaijing.com/immediately.html?type=usstock","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_zhitongcaijing","symbols":["02249","KSTR"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2648653680","title":"A股MCU概念板塊異動拉升","url":"https://stock-news.laohu8.com/highlight/detail?id=2648653680","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2648653680?lang=zh_tw&edition=fundamental","pubTime":"2026-07-03 13:01","pubTimestamp":1783054861,"startTime":"0","endTime":"0","summary":null,"market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.zhitongcaijing.com/immediately.html?type=usstock","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_zhitongcaijing","symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2648630357","title":"科創50日內漲幅達1.00%，成分股中，傳音控股漲7.91%，國博電子漲7.17%，晶合集成漲6.67%，源傑科技漲5.","url":"https://stock-news.laohu8.com/highlight/detail?id=2648630357","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2648630357?lang=zh_tw&edition=fundamental","pubTime":"2026-07-03 10:53","pubTimestamp":1783047184,"startTime":"0","endTime":"0","summary":null,"market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.zhitongcaijing.com/immediately.html?type=usstock","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_zhitongcaijing","symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2648632414","title":"科創50探底回升翻紅","url":"https://stock-news.laohu8.com/highlight/detail?id=2648632414","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2648632414?lang=zh_tw&edition=fundamental","pubTime":"2026-07-03 09:44","pubTimestamp":1783043097,"startTime":"0","endTime":"0","summary":null,"market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.zhitongcaijing.com/immediately.html?type=usstock","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_zhitongcaijing","symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1169199821","title":"新股招股 | 晶合集成今起招股，一手入場費3262.57港元","url":"https://stock-news.laohu8.com/highlight/detail?id=1169199821","media":"老虎资讯综合","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1169199821?lang=zh_tw&edition=fundamental","pubTime":"2026-06-30 08:57","pubTimestamp":1782781066,"startTime":"0","endTime":"0","summary":"6月30日，晶合集成发布公告，公司拟全球发售约2.16亿股H股，中国香港发售2161.67万股H股，国际发售约1.95亿股H股；2026年6月30日至7月7日招股，预期定价日为7月8日；发售价将为每股发售股份30.00港元-32.30港元，H股的每手买卖单位将为100股，中金公司为独家保荐人；预期H股将于2026年7月10日开始于联交所买卖。假设发售价为每股发售股份31.15港元，并假设超额配股权未获行使，公司估计将从全球发售中收取所得款项净额约65.356亿港元。","market":"hk","thumbnail":"https://static.tigerbbs.com/0bc9411b92daca5fa6f9496d92394df3","type":0,"news_type":0,"thumbnails":["https://static.tigerbbs.com/0bc9411b92daca5fa6f9496d92394df3"],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":"新股招股 | 晶合集成今起招股，一手入场费3262.57港元","news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2647683583","title":"晶合集成(02249)6月30日至7月7日招股 擬全球發售2.16億股H股 引入集創、璞新科技等基石投資者","url":"https://stock-news.laohu8.com/highlight/detail?id=2647683583","media":"智通财经","labels":["shareholding"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2647683583?lang=zh_tw&edition=fundamental","pubTime":"2026-06-30 08:23","pubTimestamp":1782779027,"startTime":"0","endTime":"0","summary":"智通财经APP讯，晶合集成 2026年6月30日至2026年7月7日招股，该公司拟全球发售2.16亿股H股，其中，香港公开发售占约10%，国际发售占约90%，另有15%超额配股权。每股发售价30-32.3港元。预期所得款项净额约23.1%将用于基于AI技术的智能研发及生产。于2023年、2024年及2025年，净利润分别为人民币1.19亿元、人民币4.82亿元及人民币4.67亿元，同年净利润率分别为1.7%、5.3%及4.5%。","market":"fut","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1460877.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"shareholding","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["IPOS","02249","688249","BK0214"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2647588799","title":"晶合集成(688249.SH)：H股發行價格最高不超過每股32.30港元","url":"https://stock-news.laohu8.com/highlight/detail?id=2647588799","media":"智通财经","labels":["shareholding"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2647588799?lang=zh_tw&edition=fundamental","pubTime":"2026-06-30 08:10","pubTimestamp":1782778235,"startTime":"0","endTime":"0","summary":"智通财经APP讯，晶合集成 发布公告，公司本次全球发售H股基础发行股数为2.16亿股，其中，初步安排香港公开发售2161.67万股，约占全球发售总数的10%;国际发售1.95亿股，约占全球发售总数的90%。在超额配售权悉数行使的情况下，公司本次全球发售H股的最大发行股数为2.49亿股。公司本次H股发行的价格最高不超过每股32.30港元。公司本次发行的H股预计于2026年7月10日在香港联交所挂牌并开始上市交易。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1460863.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"shareholding","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["BK0214","02249","688249","EWH"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1149704431","title":"新股快訊：合肥晶合集成電路（02249）啓動全球發售，最高發售價每股32.30港元","url":"https://stock-news.laohu8.com/highlight/detail?id=1149704431","media":"公告速递","labels":["shareholding","SGX"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1149704431?lang=zh_tw&edition=fundamental","pubTime":"2026-06-30 06:43","pubTimestamp":1782773014,"startTime":"0","endTime":"0","summary":"合肥晶合集成电路股份有限公司主要从事12英寸纯晶圆代工及相关技术服务，制程范围涵盖150nm至40nm，并逐步推进28nm等更先进制程。2023年至2025年，公司收入分别达71.83亿元、91.20亿元及103.88亿元人民币；同期毛利分别为14.61亿元、22.99亿元及23.58亿元人民币；研发费用分别为10.58亿元、12.84亿元及14.53亿元人民币；年内利润则分别为1.19亿元、4.82亿元及4.66亿元人民币。公司于境内A股已在科创板上市，本次计划在港交所进行H股发行，完成后将形成A股与H股并存的架构。","market":"sh","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"shareholding,SGX","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2643836397","title":"晶合集成獲得實用新型專利授權：「一種半導體薄膜沉積設備」","url":"https://stock-news.laohu8.com/highlight/detail?id=2643836397","media":"证券之星","labels":["productRelease"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2643836397?lang=zh_tw&edition=fundamental","pubTime":"2026-06-16 03:22","pubTimestamp":1781551368,"startTime":"0","endTime":"0","summary":"证券之星消息，根据天眼查APP数据显示晶合集成新获得一项实用新型专利授权，专利名为“一种半导体薄膜沉积设备”，专利申请号为CN202521427925.4，授权日为2026年6月16日。今年以来晶合集成新获得专利授权229个，较去年同期增加了36.31%。","market":"fut","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026061600003540.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"productRelease","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249","BK0214","159582","688249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2642940883","title":"770億合肥芯片「黑馬」晶合集成衝刺港股IPO：增收不增利，淨利潤大幅下滑62.61%、淨利率不足1%","url":"https://stock-news.laohu8.com/highlight/detail?id=2642940883","media":"市场资讯","labels":["dataReport"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2642940883?lang=zh_tw&edition=fundamental","pubTime":"2026-06-11 07:57","pubTimestamp":1781135820,"startTime":"0","endTime":"0","summary":"　　又一家半导体龙头企业，冲刺港股IPO。　　近期，晶合集成披露H股发行聆讯后资料集。　　数据显示，截至最新收盘，晶合集成股价报38.41元/股，总市值771亿元。自6月以来，公司股价累计下跌超15%。公司一季度实现营收29.12亿元，同比增长13.42%，但归母净利润仅5066万元，同比下滑62.61%，整体净利率不足1%。尽管占比逐年回落，但2025年该项业务占比仍高达58.06%，依旧是晶合集成最核心的收入支","market":"hk","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":["earning"],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://finance.sina.com.cn/wm/2026-06-11/doc-iniaysmc0936650.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"dataReport","news_rank":0,"length":0,"strategy_id":0,"source":"sina","symbols":["02249","688249","BK0214"],"isVideo":false,"video":null,"gpt_icon":1},{"id":"2642454843","title":"又一半導體巨頭要登陸港交所了","url":"https://stock-news.laohu8.com/highlight/detail?id=2642454843","media":"华尔街见闻","labels":["corporation"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2642454843?lang=zh_tw&edition=fundamental","pubTime":"2026-06-09 13:03","pubTimestamp":1780981430,"startTime":"0","endTime":"0","summary":"市场将如何定价","market":"fut","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://wallstreetcn.com/articles/3774189","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"corporation","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["USD","BK4585","TEKX","SSG","159582","BK4535","VGT","BK4588","SOXQ","SOXX","SOXY","FTXL","XSD","SMHX","SMH","CHPS","02249","SOXS","SOXL","HEXmain","PSI","CHPY"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2642564433","title":"晶合集成通過聆訊：第一季營收29億 淨利按年降63% 華勤技術持股11%","url":"https://stock-news.laohu8.com/highlight/detail?id=2642564433","media":"雷递网","labels":["dataReport"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2642564433?lang=zh_tw&edition=fundamental","pubTime":"2026-06-08 23:06","pubTimestamp":1780931207,"startTime":"0","endTime":"0","summary":"合肥晶合集成电路股份有限公司（简称“晶合集成”）日前通过上市聆讯，准备在港交所上市。","market":"hk","thumbnail":"https://leidinews-1256465536.cos.ap-chengdu.myqcloud.com/u_News/20260608/6391655679758032434882325.jpeg","type":0,"news_type":0,"thumbnails":["https://leidinews-1256465536.cos.ap-chengdu.myqcloud.com/u_News/20260608/6391655679758032434882325.jpeg"],"rights":null,"property":["earning"],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.leinews.com/n33964/detail.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"dataReport","news_rank":0,"length":0,"strategy_id":0,"source":"leinews_highlight","symbols":["02249","03296","603296","688249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2641486376","title":"新股消息 | 晶合集成(688249.SH)通過港交所聆訊 2025年12英寸晶圓的平均月產量為139千片","url":"https://stock-news.laohu8.com/highlight/detail?id=2641486376","media":"智通财经","labels":["dataReport"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2641486376?lang=zh_tw&edition=fundamental","pubTime":"2026-06-08 18:51","pubTimestamp":1780915864,"startTime":"0","endTime":"0","summary":"智通财经APP获悉，据港交所6月8日披露，合肥晶合集成电路股份有限公司通过港交所主板上市聆讯，中金公司为其独家保荐人。招股书显示，晶合集成是一家领先的12英寸纯晶圆代工企业，处于全球半导体价值链的关键环节。截至2025年12月31日，生产基地的总建筑面积约为387,007.6平方米，于2025年，12英寸晶圆的平均月产量为139.0千片。根据弗若斯特沙利文的资料，于2020年至2025年，全球前十大晶圆代工企业中，晶合集成的产能及收入增长速度为全球第一。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1451521.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"dataReport","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["02249","BK0214","688249","HEXmain"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2640393461","title":"晶合集成赴港IPO，專注於12英寸晶圓代工，全球第九！","url":"https://stock-news.laohu8.com/highlight/detail?id=2640393461","media":"格隆汇","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2640393461?lang=zh_tw&edition=fundamental","pubTime":"2026-06-01 16:17","pubTimestamp":1780301867,"startTime":"0","endTime":"0","summary":"市场占有率0.9%","market":"fut","thumbnail":"https://img2.gelonghui.com/842f3-a3c301f5-4921-46c0-bf4f-5f9df1a8f6c6.jpg?guru_height=870&guru_width=1569&guru_size=179753","type":0,"news_type":0,"thumbnails":["https://img2.gelonghui.com/842f3-a3c301f5-4921-46c0-bf4f-5f9df1a8f6c6.jpg?guru_height=870&guru_width=1569&guru_size=179753"],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.gelonghui.com/p/5007248","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"gelonghui_highlight","symbols":["IPOS","02249","BK0214","688249"],"isVideo":false,"video":null,"gpt_icon":0}],"pageSize":20,"totalPage":8,"pageCount":8,"totalSize":158,"code":"91000000","status":"200"}]}}