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Roundhill Memory ETF

56.12

+1.112.02%

成交量：827.73萬

成交額：4.65億

市值：246.38億

市盈率：- -

高：56.59

開：56.42

低：55.84

收：55.01

52周最高：81.34

52周最低：26.14

股本：4.39億

流通股本：4.39億

量比：0.67

換手率：1.89%

股息：- -

股息率：- -

淨資產收益率：--

總資產收益率：--

市淨率：--

市盈率(LYR):- -

資料載入中...

總覽公司新聞資訊公告

OpenAI韓國負責人：對AI驅動存儲芯片熱潮將持續充滿信心

花旗TMT會議：NPO搶跑，CPO瓶頸是測試，光互聯是「下一個HBM

华尔街见闻

韓國股市走強南方最多兩倍做多海力士漲幅擴大至9%

翻了10幾倍！澳洲一男子車庫裏意外翻出30條64GB DDR4內存：價值至少超8萬元

長鑫存儲 HBM3 試產良率停滯於 25%

兩大存儲芯片巨頭庫存告急！

Autoliv 通過虛擬測試提升汽車安全水平

瑞穗：存儲芯片擠壓手機市場但三星表現將優於大多廠商

环球市场播报

瑞穗：存儲芯片擠壓手機市場但三星表現將優於大多廠商

項立剛：存儲芯片漲價損害下游產業建議啓動反壟斷管控

存儲芯片突破仲夏盤整! AGI狂潮疊加RSI新訓練範式，高盛嗅到新一輪存儲牛市氣息

項立剛：存儲芯片漲價損害下游產業，建議啓動反壟斷管控

凤凰网港股

存儲芯片價格暴升逾100%！華強北手機集體漲價最高1500元

三星計劃在2028年前後將阿斯麥(ASML.US)的頂尖光刻設備用於DRAM生產。

異動解讀｜Roundhill Memory ETF夜盤上漲5.08%，存儲芯片庫存告急疊加DRAM景氣度獲確認

港股異動 | 兆易創新(03986)升逾4% 存儲芯片市場正面臨嚴重供應短缺

存儲芯片概念延續反彈盈新發展直線漲停

ETF異動 | 韓國ETF今日繼續走高三星、SK海力士內存庫存告急高盛堅守韓股12000點目標

智通财经网

港股開盤｜港股低開；科技股承壓；南方東英海力士ETF升逾7%

機構：三星、SK海力士Q2 DRAM市場合計市佔達六成

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DDR4内存的售价已经炒到了400美元左右，粗略估算下来这批30条内存的总价值刚好能摸到1.2万美元的门槛。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://tech.ifeng.com/c/8wGyPCbAUCG","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"fenghuang_stock","symbols":["DRAL","BK4588","RAMZ","DRAM","RAM"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2666657305","title":"長鑫存儲 HBM3 試產良率停滯於 25%","url":"https://stock-news.laohu8.com/highlight/detail?id=2666657305","media":"链捕手","labels":["dataReport"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2666657305?lang=zh_tw&edition=fundamental","pubTime":"2026-09-09 08:23","pubTimestamp":1788913423,"startTime":"0","endTime":"0","summary":" ChainCatcher 消息，据朝鲜日报报道，中国最大 DRAM 厂商长鑫存储（CXMT）已启动第四代高带宽存储器 HBM3 试验生产，初期良率停滞在 25%，约为量产黄金良率 80% 的三分之一。SK 海力士自 2022 年起量产同类产品，良率超过 90%。长鑫存储 HBM3 8 层堆叠产品前道工序良率约 30%，后道工序后约 70% 成为最终良品。公司将少量样品供应给阿里巴巴平头哥、寒武纪等中国企业并持续改善良率。其 G4（17 纳米级）工艺普通 DRAM 无大问题，但 HBM 用 DRAM 芯片面积更大、电气规格更严格。业界将原因指向硅通孔 TSV 技术成熟度不足。Nomad Semi 分析显示，三星 HBM2 每芯片 TSV 超 5000 个，SK 海力士 HBM3 超 8000 个，长鑫存储约 3000 个。与三星、SK 海力士存在 4 至 5 年差距。 ","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.chaincatcher.com/article/2288397","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"dataReport","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["MIC","DRMP","MUG","DISK","BK4588","MULL","MUD","MUYY","RAM","DRMY","MUU","EMXC","MUZ","DRAL","RAMZ","BK4585","DRAM"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2666308562","title":"兩大存儲芯片巨頭 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通過虛擬測試提升汽車安全水平","url":"https://stock-news.laohu8.com/highlight/detail?id=2666374782","media":"美通社","labels":["productRelease"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2666374782?lang=zh_tw&edition=fundamental","pubTime":"2026-09-08 23:32","pubTimestamp":1788881520,"startTime":"0","endTime":"0","summary":"Autoliv 人体模型安全套件 Autoliv 的 HBM 安全套件是一体化虚拟安全平台，集成了用于碰撞仿真的先进人体模型，以及支持分析、可视化和决策的专用软件工具。Autoliv 的 HBM 安全套件将复杂的仿真数据转化为清晰、可用于指导决策的分析结果，帮助工程师在虚拟环境中评估安全性能，并针对不同乘员群体优化安全解决方案。Toyota 近期已开始在其虚拟安全研发工作中使用 Autoliv 的 HBM 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