美股詳情

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iShares MSCI Emerging Markets ex China ETF

99.12

+1.982.04%

成交量：14.14萬

成交額：1,401.11萬

市值：253.85億

市盈率：- -

高：99.27

開：99.02

低：98.84

收：97.14

52周最高：107.12

52周最低：66.62

股本：2.56億

流通股本：2.56億

量比：0.99

換手率：0.06%

股息：1.92

股息率：1.94%

淨資產收益率：--

總資產收益率：--

市淨率：--

市盈率(LYR):- -

資料載入中...

總覽公司新聞資訊公告

摩根大通警告：歐盟「轉型基金」標籤過嚴，或令新興市場融資受阻

報告：三星擴大全球DRAM市場領先優勢，份額達39%

环球市场播报

消息稱三星將半數4納米產能投入HBM4基礎裸片生產

三星與SK海力士庫存降至不足10天用量

韓國券商警告：三星、SK海力士內存庫存降至不足10天供應量

KOSPI狂飆衝擊 7,000 點，軟銀暴升逾11%，鎧俠、三星與SK海力士全線走高

TradingKey中文

未來資產證券：三星 HBM 出貨擴張料將抵消 2027 年通用存儲增長放緩

海力士股價延續漲勢，最新報177萬韓元，漲幅7.5%。

摩根士丹利看多印度股市：基準情景預計2027年6月敏感指數站上89000點

港股異動 | 三環集團(06951)早盤升逾9% 三星電機簽訂MLCC大單驗證MLCC行業景氣度持續提升

報告稱國產CMOS廠商豪威去年全球份額首超三星，位居世界第二

全球債市動盪之際新興市場成「避風港」！實際利率高企及財政狀況強勁引華爾街側目

ETF周報 | 2倍做多Robinhood ETF升逾34%；二倍做多彭博原油ETF升逾11%；三倍做多半導體ETF升逾5%；加密與油氣鏈條槓桿居前

中國科技創新吸引全球未來企業家

三星與Arm聯手殺入端側AI！2nm定製芯片啓動，OpenAI或成關鍵客户

华尔街见闻

瀚亞投資：新興市場集中度升至近25年高位主動價值策略具分散優勢

SK 海力士：Solidigm 融資相關事項尚未確定。

機構：第二季度全球NAND市場按月增長70%，三星和SK海力士保持前兩位

环球市场播报

大行評級丨野村：存儲器供需緊張料延續，重申三星、SK海力士「買入」評級

期權聚焦 | 台積電驚現331萬美元熊市看漲價差，機構賣出420Call收租、押注長期上漲空間受限

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17:31","pubTimestamp":1788773460,"startTime":"0","endTime":"0","summary":"市场研究机构集邦咨询周一发布的一份行业报告显示，2026年第二季度，三星电子以营收口径计算占据全球动态随机存取存储器市场39.4%的份额，在全球人工智能热潮下进一步扩大领先优势。报告显示，美国美光科技第二季度全球DRAM市场份额为23.3%，高于上一季度的22.4%；该季度营收环比上涨65.5%，达到360亿美元。集邦咨询表示，受各类存储产品出货量增长推动，全球DRAM市场第二季度总营收达1547.3亿美元，环比提升59.5%。","market":"sg","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://finance.sina.com.cn/stock/usstock/c/2026-09-07/doc-iniqyzxx0268867.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"dataReport","news_rank":0,"length":0,"strategy_id":0,"source":"sina","symbols":["DISK","RAM","RAMZ","BK4585","DRMY","MIC","MUZ","DRAM","DRMP","MUU","EMXC","MUG","BK4588","MUD","DRAL","MULL","MUYY"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2665531800","title":"消息稱三星將半數4納米產能投入HBM4基礎裸片生產","url":"https://stock-news.laohu8.com/highlight/detail?id=2665531800","media":"IT之家","labels":["corporation"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2665531800?lang=zh_tw&edition=fundamental","pubTime":"2026-09-07 16:42","pubTimestamp":1788770557,"startTime":"0","endTime":"0","summary":"IT之家 9 月 7 日消息，据韩国媒体 ZDNet Korea 报道，三星电子旗下负责芯片制造业务的三星晶圆代工部门 据称正在为 HBM4 基础裸片的生产预留大量产能。据报道，三星 4nm 工艺，也就是内部称为 SF4 的产线，有约一半的整体产能将用于生产 HBM4 基础裸片。目前，HBM4 以及即将推出的 HBM4E 内存标准的客户，正要求在基础裸片中加入定制逻辑电路。随着市场需求增长，三星不仅需要扩大外部客户 ASIC 设计的生产规模，HBM4 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16:26","pubTimestamp":1788769579,"startTime":"0","endTime":"0","summary":"存储半导体的短缺情况似乎还在恶化。韩国券商KBSecurities最新警告，三星电子和SK海力士的存储半导体库存已降至不足10天的供应量，明年可用供应将明显不足。KBSecurities在周一发布的报告中指出，随着人工智能基础设施投资以前所未有的速度扩张，存储芯片市场正面临严重的供应短缺。加剧供应短缺的一个关键因素是向下一代高带宽存储器HBM4的过渡。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"stock_eastmoney","url":"http://finance.eastmoney.com/a/202609073866704587.html","rn_cache_url":null,"directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://finance.eastmoney.com/a/202609073866704587.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"dataReport","news_rank":0,"length":0,"strategy_id":0,"source":"stock_eastmoney","symbols":["SKDD","DRAL","DRAM","07709","LU0823413660.USD","SKHA","SKHN","BK4141","LU0823397285.USD","KCE","LU0823397103.USD","EDZ","SK","SKUU","HYNX","LU1956131251.USD","SKHL","SKHY","SKHYV","LU0823413587.USD","RAM","EEMO","RAMZ","SKHZ","SKHU","SKHX","BK4585","SKHQ","EMXC","BK4588"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2665392105","title":"KOSPI狂飆衝擊 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HBM 出貨擴張料將抵消 2027 年通用存儲增長放緩","url":"https://stock-news.laohu8.com/highlight/detail?id=2665394997","media":"链捕手","labels":["dataReport"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2665394997?lang=zh_tw&edition=fundamental","pubTime":"2026-09-07 14:15","pubTimestamp":1788761702,"startTime":"0","endTime":"0","summary":" ChainCatcher 消息，未来资产证券分析师 Kim Young-gun 表示，三星电子面向 AI 应用的 HBM 出货量的扩张，预计将抵消明年通用存储芯片增长放缓的影响。预计三星电子 2027 年 HBM 出货容量和平均售价将分别飙升 57% 和 49%，有望超过通用存储芯片预计的 16% 和 20% 增速。未来资产预计三星的盈利将受到韩元兑美元走强的拖累，但总体仍将保持稳健。该机构将三星 2026 年营业利润预测下调 5.7% 至 370.057 万亿韩元，2027 年下调 4.2% 至 535.682 万亿韩元。 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Morgan EM Local Currency Bond ETF上涨0.63%。Invesco 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