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STMicroelectronics NV ADRhedged

10.13

+0.31693.23%

盤後：10.06-0.0718-0.71%16:10 EDT

成交量：2,895

成交額：2.90萬

市值：192.50萬

市盈率：- -

高：10.13

開：10.02

低：9.98

收：9.81

52周最高：16.26

52周最低：4.33

股本：19.00萬

流通股本：19.00萬

量比：0.62

換手率：1.52%

股息：0.22

股息率：2.19%

淨資產收益率：--

總資產收益率：--

市淨率：--

市盈率(LYR):- -

資料載入中...

總覽公司新聞資訊公告

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消息稱模擬芯片需求堅挺，供應吃緊至少持續 2 年

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模擬芯片概念震盪走強敏芯股份升逾10%

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宇晶股份：擬定增募資不超1.76億元，用於大尺寸硅片及碳化硅設備研發等項目

廣汽押中3.28萬億元IPO：長鑫科技上市汽車芯片版圖浮出水面

中国经营报

基本半導體(09971.HK)：擬建造碳化硅模塊封裝產線基地

基本半導體(09971)：擬建造碳化硅模塊封裝產線基地

{"basename":"/hant","ssrTDKData":{"titleTemplate":"%s - 老虎證券","title":"Easy breezy. No more feesies.","description":"Tiger Trade is a mobile trading app offering real time data, low commission fees and a free demo account. Download now to start investing in ETFs, options and the global share market.","keywords":"老虎國際,美股交易,港股交易,交易美股,股票信息,股價,美股行情,美股打新,港股打新,IPO打新,購買美股,全球投資","social":{"ogDescription":"Tiger Trade is a mobile trading app offering real time data, low commission fees and a free demo account. Download now to start investing in ETFs, options and the global share market.","ogImage":"https://c1.itigergrowtha.com/portal5/static/media/og-logo.0a0bd8dc.png","ogUrl":"https://www.thetigerbrokers.com/hant/stock/STHH/news?page=3"},"companyName":"老虎證券"},"pageData":{"isMobile":false,"isTiger":false,"isTTM":true,"region":"NZL","license":"TBKIWI","edition":"fundamental","symbol":"STHH","isAnalysisPage":false},"__swrFallback__":{"@#url:\"https://hq.skytigris.cn/stock_info/detail/global\",params:#delay:false,,method:\"POST\",data:#items:@#symbol:\"STHH\",,,,,undefined,":{"symbol":"STHH","market":"US","secType":"STK","nameCN":"STMicroelectronics NV ADRhedged","latestPrice":10.1318,"timestamp":1789761600000,"preClose":9.8149,"halted":0,"volume":2895,"hourTrading":{"tag":"盘后","latestPrice":10.06,"preClose":10.1318,"latestTime":"16:10 EDT","volume":6,"amount":60.8072,"timestamp":1789762204280,"change":-0.0718,"changeRate":-0.007087,"amplitude":0},"delay":0,"changeRate":0.032287644295917475,"floatShares":190000,"shares":190000,"eps":0,"marketStatus":"休市中","change":0.3169,"latestTime":"09-18 16:00:00 EDT","open":10.02,"high":10.1318,"low":9.98,"amount":29013,"amplitude":0.015466,"askPrice":0,"askSize":0,"bidPrice":0,"bidSize":0,"shortable":3,"etf":1,"ttmEps":0,"tradingStatus":0,"nextMarketStatus":{"tag":"盤前交易","tradingStatus":1,"beginTime":1789977600000},"marketStatusCode":7,"adr":0,"exchange":"ARCA","adjPreClose":9.8149,"nav":9.817006,"aum":1865329.31006,"dividendRate":0.021881,"bidAskSpread":0,"postHourTrading":{"tag":"盘后","latestPrice":10.06,"preClose":10.1318,"latestTime":"16:10 EDT","volume":6,"amount":60.8072,"timestamp":1789762204280,"change":-0.0718,"changeRate":-0.007087,"amplitude":0},"volumeRatio":0.6187484009922314,"impliedVol":0.2536,"impliedVolPercentile":0.2373},"@#url:\"https://hq.skytigris.cn/stock_info/fundamental/all\",params:#delay:false,,method:\"POST\",data:#items:@#symbol:\"STHH\",,,,,undefined,":{"symbol":"STHH","floatShares":190000,"roa":"--","roe":"--","lyrEps":0,"volumeRatio":0.6187484009922314,"shares":190000,"dividePrice":0.221693,"high":10.1318,"amplitude":0.015466,"preClose":9.8149,"low":9.98,"week52Low":4.3299,"pbRate":"--","week52High":16.257,"institutionHeld":0,"latestPrice":10.1318,"eps":0,"divideRate":0.021881,"volume":2895,"delay":0,"ttmEps":0,"open":10.02,"prevYearClose":5.148,"prevWeekClose":10.3802,"prevMonthClose":10.11,"prevQuarterClose":15.1019,"fiveDayClose":10.3802,"twentyDayClose":10.03,"sixtyDayClose":14.539},"@#url:\"https://hq.skytigris.cn/fundamental/corporate_actions/details/STHH\",params:#limit:5,,,undefined,":[{"date":"2026-09-16","symbol":"STHH","amount":0.11865,"announcedDate":"2026-09-15","type":"dividend","lastAmount":null,"market":"US","newRecordDate":"2026-09-16","defaultRemindTime":1789565400000,"name":"STMicroelectronics NV ADRhedged","lastCurrency":null,"lastExecuteDate":null,"recordDate":"2026-09-23","payableDate":"2026-09-16","currency":"USD","dateTimestamp":1789531200000,"payDate":"2026-09-23"},{"market":"US","date":"2026-07-14","symbol":"STHH","defaultRemindTime":1784035800000,"type":"split","dateTimestamp":1784001600000,"forFactor":1,"toFactor":10,"ratio":0.1},{"date":"2026-06-16","symbol":"STHH","amount":0.16,"announcedDate":"2026-06-15","type":"dividend","lastAmount":null,"market":"US","newRecordDate":"2026-06-16","defaultRemindTime":1781616600000,"name":"STMicroelectronics NV ADRhedged","lastCurrency":null,"lastExecuteDate":null,"recordDate":"2026-06-23","payableDate":"2026-06-16","currency":"USD","dateTimestamp":1781582400000,"payDate":"2026-06-23"},{"date":"2026-03-16","symbol":"STHH","amount":0.51688,"announcedDate":"2026-03-13","type":"dividend","lastAmount":null,"market":"US","newRecordDate":"2026-03-16","defaultRemindTime":1773667800000,"name":"STMicroelectronics NV ADRhedged","lastCurrency":null,"lastExecuteDate":null,"recordDate":"2026-03-23","payableDate":"2026-03-16","currency":"USD","dateTimestamp":1773633600000,"payDate":"2026-03-23"},{"date":"2025-12-16","symbol":"STHH","amount":0.35355,"announcedDate":"2025-12-15","type":"dividend","lastAmount":null,"market":"US","newRecordDate":"2025-12-16","defaultRemindTime":1765895400000,"name":"STMicroelectronics NV ADRhedged","lastCurrency":null,"lastExecuteDate":null,"recordDate":"2025-12-24","payableDate":"2025-12-16","currency":"USD","dateTimestamp":1765861200000,"payDate":"2025-12-24"}],"@#url:\"https://hq.skytigris.cn/fundamental/dividend/history\",params:#symbol:\"STHH\",market:\"US\",,,undefined,":[{"executeDate":"2025-12-16","recordDate":"2025-12-16","paymentDate":"2025-12-24","value":0.35355,"currency":"USD"},{"executeDate":"2026-03-16","recordDate":"2026-03-16","paymentDate":"2026-03-23","value":0.51688,"currency":"USD"},{"executeDate":"2026-06-16","recordDate":"2026-06-16","paymentDate":"2026-06-23","value":0.16,"currency":"USD"},{"executeDate":"2026-09-16","recordDate":"2026-09-16","paymentDate":"2026-09-23","value":0.11865,"currency":"USD"}],"@#url:\"https://hq.skytigris.cn/fundamental/estimate/recommendation\",params:#symbol:\"STHH\",market:\"US\",delay:false,,,undefined,":{},"$inf$@#url:\"https://stock-news.skytigris.cn/v2/news/list\",params:#symbols:\"STHH\",pageSize:20,pageCount:3,lang_content:\"cn\",edition:\"fundamental\",,,undefined,":[{"items":[{"id":"2660490021","title":"從成本傳導走向AI需求共振 功率半導體行業迎景氣周期","url":"https://stock-news.laohu8.com/highlight/detail?id=2660490021","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2660490021?lang=zh_tw&edition=fundamental","pubTime":"2026-08-19 07:29","pubTimestamp":1787095789,"startTime":"0","endTime":"0","summary":null,"market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.zhitongcaijing.com/immediately.html?type=usstock","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_zhitongcaijing","symbols":["AIPO","ARTY","STHH","AGIX","VTHR","QTOC","CHAT"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2660464002","title":"消息稱模擬芯片需求堅挺，供應吃緊至少持續2年","url":"https://stock-news.laohu8.com/highlight/detail?id=2660464002","media":"IT之家","labels":["dataReport"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2660464002?lang=zh_tw&edition=fundamental","pubTime":"2026-08-18 17:46","pubTimestamp":1787046374,"startTime":"0","endTime":"0","summary":"IT之家 8 月 18 日消息，据台媒《电子时报》今日报道，业界声音显示目前 AI 浪潮下以功率半导体为代表的模拟芯片迎来旺盛而坚挺的需求，这波供应吃紧至少要持续 2 年。报道指出，模拟芯片业者表示下游需求预估呈逐年倍增态势，客户信心十足；即使产业积极扩充 12 英寸  产能，供给增长的速度也跟不上需求暴涨的幅度。这意味着相关产品还有进一步涨价空间。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://tech.ifeng.com/c/8vgssqFqyFk","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"dataReport","news_rank":0,"length":0,"strategy_id":0,"source":"fenghuang_stock","symbols":["TSEG","ADIU","STHH","SMTG","NXPX","TXNU","NXPG","MCHU","MCHG"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2660141501","title":"消息稱模擬芯片需求堅挺，供應吃緊至少持續 2 年","url":"https://stock-news.laohu8.com/highlight/detail?id=2660141501","media":"IT之家","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2660141501?lang=zh_tw&edition=fundamental","pubTime":"2026-08-18 17:46","pubTimestamp":1787046374,"startTime":"0","endTime":"0","summary":"IT之家 8 月 18 日消息，据台媒《电子时报》今日报道，业界声音显示目前 AI 浪潮下以功率半导体为代表的模拟芯片迎来旺盛而坚挺的需求，这波供应吃紧至少要持续 2 年。报道指出，模拟芯片业者表示下游需求预估呈逐年倍增态势，客户信心十足；即使产业积极扩充 12 英寸  产能，供给增长的速度也跟不上需求暴涨的幅度。这意味着相关产品还有进一步涨价空间。","market":"hk","thumbnail":"https://k.sinaimg.cn/n/spider20260818/567/w820h547/20260818/fd07-e7e7d5d7f7b8ee8fc0ad916a0b33bacf.jpg/w120h90l50t12f9.jpg","type":0,"news_type":0,"thumbnails":["https://k.sinaimg.cn/n/spider20260818/567/w820h547/20260818/fd07-e7e7d5d7f7b8ee8fc0ad916a0b33bacf.jpg/w120h90l50t12f9.jpg"],"rights":{"source":"sina_tech","url":"https://tech.sina.cn/mobile/xp/2026-08-19/detail-ininttrs3265456.d.html?vt=4","rn_cache_url":null,"customStyle":"body{padding-top:10px;}.art_tit_h1{#titleStyle#}a{#lv2TextColor#}.art_time, .art_cite{#sourceStyle#;} .art_cite{margin-left: 3px;}.weibo_user{#sourceStyle#; margin-bottom: 0; display: inline-block;}.weibo_time{#sourceStyle#};","selectors":".module-article, article","filters":"header, .voice2, .tags, #norm_qrcode_link_auto, .unfold-box, .action, .j_float_wbro, .j_article_wbreco","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://tech.sina.cn/mobile/xp/2026-08-19/detail-ininttrs3265456.d.html?vt=4","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"sina_tech","symbols":["TSEG","STHH","NXPG","MCHG","ADIU","TXNU","SMTG","NXPX","MCHU"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2660452517","title":"台灣地區功率半導體廠商醖釀第三波漲價","url":"https://stock-news.laohu8.com/highlight/detail?id=2660452517","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2660452517?lang=zh_tw&edition=fundamental","pubTime":"2026-08-18 14:19","pubTimestamp":1787033984,"startTime":"0","endTime":"0","summary":null,"market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.zhitongcaijing.com/immediately.html?type=usstock","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_zhitongcaijing","symbols":["STHH"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2660437711","title":"Coherent開始向客户送樣300毫米、高熱導率碳化硅基板","url":"https://stock-news.laohu8.com/highlight/detail?id=2660437711","media":"格隆汇","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2660437711?lang=zh_tw&edition=fundamental","pubTime":"2026-08-18 06:22","pubTimestamp":1787005373,"startTime":"0","endTime":"0","summary":null,"market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.gelonghui.com/rss/live/live.xml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_gelonghui","symbols":["LU2272731782.SGD","SGXZ81514606.USD","BK4148","IE00B66KJ199.SGD","LU2089985449.USD","LU2272731865.HKD","SGXZ99366536.SGD","BK4585","EGGY","LU1992135399.USD","COHC","LU1861220033.SGD","IE00B19Z4B17.USD","LU2272731600.USD","BK4157","LU2357305700.SGD","LU2360107168.USD","LUMA","SGXZ51526630.SGD","COHR","LU0266013472.USD","LU1992135472.HKD","LU2931357623.SGD","SPRX","IE00B7SZL793.SGD","LU1548497426.USD","FOTO","LU2211815571.USD","LU1861215975.USD","IE0031619046.USD","BK4588","STHH","COHX","LU2322448957.HKD","LU0274383776.USD","LU1720051017.SGD","LU2290526834.HKD","LU2322448791.USD","LU2473716301.USD","LU1720051108.HKD","COHH"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2660815494","title":"壁壘高築，景氣上行！展芯股份：如何在軍工模擬芯片賽道突圍？","url":"https://stock-news.laohu8.com/highlight/detail?id=2660815494","media":"市场资讯","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2660815494?lang=zh_tw&edition=fundamental","pubTime":"2026-08-17 18:16","pubTimestamp":1786961760,"startTime":"0","endTime":"0","summary":"自2018年起，展芯股份仅靠自身内生性发展便实现了收入与利润的快速增长，证明了公司在研发、生产、销售端的成功，这使它成为国内军用模拟芯片领域一个绕不开的名字。展芯股份成立于2018年，自设立起公司即聚焦军工电子配套为主的产品应用领域和以高可靠集成电路、微模块为主的产品研发方向，主营业务为高可靠模拟芯片及微模块的研发设计、测试及销售。而展芯，恰好站在了潮头。在民营军工配套企业中，展芯已经位居前列。","market":"sg","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://finance.sina.com.cn/stock/s/2026-08-17/doc-ininrqsp7717770.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"sina","symbols":["STHH","TSEG","NXPG","301707","NXPX","SMTG","ADIU","TXNU","MCHU","161024","MCHG","SHLD"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2660093491","title":"我國汽車芯片五項認證認可行業標準發布","url":"https://stock-news.laohu8.com/highlight/detail?id=2660093491","media":"格隆汇","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2660093491?lang=zh_tw&edition=fundamental","pubTime":"2026-08-17 10:04","pubTimestamp":1786932292,"startTime":"0","endTime":"0","summary":null,"market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.gelonghui.com/rss/live/live.xml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_gelonghui","symbols":["MCHU","BK4147","SHOC","NXPX","TSEG","NXPG","MCHG","SMHC","BESIY","SMTG","ADIU","TXNU","STHH","ARMH"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2659372194","title":"模擬芯片概念震盪走強 敏芯股份升逾10%","url":"https://stock-news.laohu8.com/highlight/detail?id=2659372194","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2659372194?lang=zh_tw&edition=fundamental","pubTime":"2026-08-14 10:17","pubTimestamp":1786673836,"startTime":"0","endTime":"0","summary":null,"market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.zhitongcaijing.com/immediately.html?type=usstock","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_zhitongcaijing","symbols":["TSEG","TXNU","NXPX","MCHG","MCHU","STHH","ADIU","NXPG","SMTG"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2658923015","title":"凱龍高科子公司重結晶碳化硅載體獲上汽大通輕客項目定點","url":"https://stock-news.laohu8.com/highlight/detail?id=2658923015","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2658923015?lang=zh_tw&edition=fundamental","pubTime":"2026-08-12 12:50","pubTimestamp":1786510218,"startTime":"0","endTime":"0","summary":null,"market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.zhitongcaijing.com/immediately.html?type=usstock","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_zhitongcaijing","symbols":["STHH"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2658711964","title":"港股異動 | 聖邦股份(03661)盤中漲近10% 傳模擬芯片大廠ADI漲價  公司有望受益行業上行周期","url":"https://stock-news.laohu8.com/highlight/detail?id=2658711964","media":"智通财经","labels":["dataReport"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2658711964?lang=zh_tw&edition=fundamental","pubTime":"2026-08-11 13:53","pubTimestamp":1786427637,"startTime":"0","endTime":"0","summary":"智通财经APP获悉，圣邦股份盘中涨近10%，截至发稿，涨7.93%，报98.05港元，成交额7117.4万港元。值得一提的是，模拟芯片今年涨价不断，意法半导体、德州仪器等此前先后发布涨价函。光大证券曾指，模拟芯片行业迎涨价周期，圣邦股份作为模拟芯片领域的领先企业，有望受益于行业上行周期。而圣邦股份以2025年收入全球第八、中国国内第一的身份领跑，占全球市场份额1.8%。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1478417.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"dataReport","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["LU0053666078.USD","LU2458330243.SGD","300661","IE00BZ199S13.USD","SMTG","NXPX","STHH","BK4585","LU1815336760.USD","KCAI","BK0125","ADIU","LU1146622755.USD","LU2272731782.SGD","LU0094547139.USD","LU0889565833.HKD","MCHG","TXNU","LU0124384867.USD","LU0077335932.USD","LU0957808578.USD","LU2361044865.SGD","LU1861219969.SGD","IE00BZ1G4Q59.USD","LU1670710661.SGD","NXPG","LU2272731600.USD","ADI","IE0009356076.USD","IE00BD6J9T35.USD","LU1074936037.SGD","MCHU","03661","TSEG","LU2458330169.SGD","LU2275660780.HKD","LU1670711040.USD","LU1244550221.USD","IE00B1BXHZ80.USD","LU1244550494.USD","VXUS","BK4561","LU0082616367.USD","LU2361045086.USD","LU1820825898.SGD","LU0210528500.USD","LU0314106906.USD","LU1978683503.SGD","LU0312595415.SGD","LU0444971666.USD"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2658966916","title":"港股異動 | 天岳先進(02631)再升逾5% 天岳先進引領碳化硅產業邁入12英寸時代","url":"https://stock-news.laohu8.com/highlight/detail?id=2658966916","media":"智通财经","labels":["productRelease"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2658966916?lang=zh_tw&edition=fundamental","pubTime":"2026-08-11 10:43","pubTimestamp":1786416232,"startTime":"0","endTime":"0","summary":"智通财经APP获悉，天岳先进再涨超5%，月内累计涨幅接近45%。消息面上，8月6日，2025年度山东省科学技术奖励大会在济南举行。天岳先进牵头攻关的 “大尺寸高质量碳化硅半导体衬底材料关键技术研发及产业化” 项目荣获山东省科学技术进步奖特等奖。东吴证券香港发布研报称，2026Q1随着8英寸产品快速放量，天岳先进毛利率修复至接近20%，8英寸收入占比已提升至约45%，盈利能力较2025年明显改善。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1478346.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"productRelease","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["STHH","BK4585","KCAI","BK4588","02631","BK0214","VXUS","688234","BK1169"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2658609725","title":"Wolfspeed與光寶科技合作800 VDC碳化硅電源解決方案","url":"https://stock-news.laohu8.com/highlight/detail?id=2658609725","media":"南方财经网","labels":["corporation"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2658609725?lang=zh_tw&edition=fundamental","pubTime":"2026-08-10 10:02","pubTimestamp":1786327320,"startTime":"0","endTime":"0","summary":"南方财经8月10日电，据Wolfspeed消息，Wolfspeed与光宝科技宣布达成战略合作，Wolfspeed碳化硅(SiC)技术在光宝科技800VDCsidecar（侧车/侧挂式机架）及计算机架电源供应单元等平台完成适配，以支持超大规模数据中心客户的下一代人工智能数据中心，并有望获多家云服务提供商平台及未来部署采用。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"stock_eastmoney","url":"http://finance.eastmoney.com/a/202608103836309670.html","rn_cache_url":null,"directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://finance.eastmoney.com/a/202608103836309670.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"corporation","news_rank":0,"length":0,"strategy_id":0,"source":"stock_eastmoney","symbols":["BK4585","STHH","BK4588","VDC"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2658094176","title":"Wolfspeed與光寶科技合作800 VDC碳化硅電源解決方案","url":"https://stock-news.laohu8.com/highlight/detail?id=2658094176","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2658094176?lang=zh_tw&edition=fundamental","pubTime":"2026-08-10 10:01","pubTimestamp":1786327318,"startTime":"0","endTime":"0","summary":null,"market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.zhitongcaijing.com/immediately.html?type=usstock","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_zhitongcaijing","symbols":["BK4588","BK4585","VDC","STHH"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2656554363","title":"美股碳化硅龍頭Wolfspeed盤初上漲8%。","url":"https://stock-news.laohu8.com/highlight/detail?id=2656554363","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2656554363?lang=zh_tw&edition=fundamental","pubTime":"2026-08-04 21:55","pubTimestamp":1785851746,"startTime":"0","endTime":"0","summary":null,"market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.zhitongcaijing.com/immediately.html?type=usstock","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_zhitongcaijing","symbols":["STHH"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2656325705","title":"基本半導體與漢磊科技達成戰略合作，加快8英寸碳化硅晶圓開發及量產","url":"https://stock-news.laohu8.com/highlight/detail?id=2656325705","media":"财中社","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2656325705?lang=zh_tw&edition=fundamental","pubTime":"2026-08-04 18:17","pubTimestamp":1785838620,"startTime":"0","endTime":"0","summary":"8月4日，基本半导体（09971）发布公告，公司已与汉磊科技股份有限公司达成战略合作。此次战略合作，双方将在之前长期合作的基础上，加快8英寸碳化硅晶圆的开发及量产。基于公司半导体的先进产品技术和市场优势以及汉磊科技高质量大规模晶圆制造能力，共同推进新工艺平台开发和量产落地，提升碳化硅产品在新能源汽车、AI算力中心等领域的市场份额。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"stock_eastmoney","url":"http://finance.eastmoney.com/a/202608043831315543.html","rn_cache_url":null,"directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://finance.eastmoney.com/a/202608043831315543.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stock_eastmoney","symbols":["STHH","BK1163","09971"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2656534212","title":"基本半導體：與漢磊科技達成戰略合作，加快8英寸碳化硅晶圓開發量產","url":"https://stock-news.laohu8.com/highlight/detail?id=2656534212","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2656534212?lang=zh_tw&edition=fundamental","pubTime":"2026-08-04 18:10","pubTimestamp":1785838227,"startTime":"0","endTime":"0","summary":null,"market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.zhitongcaijing.com/immediately.html?type=usstock","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_zhitongcaijing","symbols":["STHH"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2655087126","title":"宇晶股份：擬定增募資不超1.76億元，用於大尺寸硅片及碳化硅設備研發等項目","url":"https://stock-news.laohu8.com/highlight/detail?id=2655087126","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2655087126?lang=zh_tw&edition=fundamental","pubTime":"2026-07-30 19:33","pubTimestamp":1785411217,"startTime":"0","endTime":"0","summary":null,"market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.zhitongcaijing.com/immediately.html?type=usstock","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_zhitongcaijing","symbols":["STHH"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2655970857","title":"廣汽押中3.28萬億元IPO：長鑫科技上市 汽車芯片版圖浮出水面","url":"https://stock-news.laohu8.com/highlight/detail?id=2655970857","media":"中国经营报","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2655970857?lang=zh_tw&edition=fundamental","pubTime":"2026-07-29 15:58","pubTimestamp":1785311908,"startTime":"0","endTime":"0","summary":"长鑫科技首次公开发行股票数量约66.88亿股，超额配售选择权全额行使前，募集资金总额约579.19亿元；若超额配售选择权全额行使，募集资金总额将增至约666.07亿元。按基础发行规模计算，长鑫科技是2026年以来A股募资规模最大的IPO，也是科创板开板以来募资规模最大的IPO。该公司同时是科创板试点IPO预先审阅机制后的首个上市项目。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"stock_eastmoney","url":"http://finance.eastmoney.com/a/202607293825091632.html","rn_cache_url":null,"directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://finance.eastmoney.com/a/202607293825091632.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stock_eastmoney","symbols":["SMHC","STHH","IPOS","KCE","BK4127","ADIU","BK4147","TSEG","SHOC","NXPG","TXNU","FRHC","ARMH","NXPX","SMTG","688825","REDS","BK1539","BESIY","02238","BK1119","MCHG","MCHU"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2654802682","title":"基本半導體(09971.HK)：擬建造碳化硅模塊封裝產線基地","url":"https://stock-news.laohu8.com/highlight/detail?id=2654802682","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2654802682?lang=zh_tw&edition=fundamental","pubTime":"2026-07-28 06:16","pubTimestamp":1785190560,"startTime":"0","endTime":"0","summary":null,"market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.zhitongcaijing.com/immediately.html?type=usstock","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_zhitongcaijing","symbols":["STHH"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2654702681","title":"基本半導體(09971)：擬建造碳化硅模塊封裝產線基地","url":"https://stock-news.laohu8.com/highlight/detail?id=2654702681","media":"智通财经","labels":["corporation"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2654702681?lang=zh_tw&edition=fundamental","pubTime":"2026-07-28 06:16","pubTimestamp":1785190560,"startTime":"0","endTime":"0","summary":"智通财经APP讯，基本半导体(09971)发布公告，于2026年7月27日，公司与承包商(中国建筑第二工程局有限公司)就该项目订立工程总承包合约。据此，承包商同意承接公司碳化硅模块封装产线基地的工程，合约价格总价为人民币1.933亿元。主要事项及工程范围：涉及建造公司位于深圳市坪山区丹梓大道与翠景路交汇处西南角的产线基地，集团已就此取得国有建设用地使用权，承包商负责项目的施工工程。工程规模：总建筑面积59,357.54平方米，建筑2栋，含厂房、办公及宿舍等配套建筑。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1472854.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"corporation","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["STHH","09971","BK1163"],"isVideo":false,"video":null,"gpt_icon":0}],"pageSize":20,"totalPage":4,"pageCount":3,"totalSize":63,"code":"91000000","status":"200"}]}}