美股詳情

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Tradr 2X Long SOXX Monthly ETF

22.36

0.0000

成交量：- -

成交額：- -

市值：190.06萬

市盈率：- -

高：22.36

開：22.36

低：22.36

收：22.36

52周最高：22.36

52周最低：22.36

股本：8.50萬

流通股本：8.50萬

量比：- -

換手率：- -

股息：- -

股息率：- -

淨資產收益率：--

總資產收益率：--

市淨率：--

市盈率(LYR):- -

資料載入中...

總覽公司新聞資訊公告

半導體板塊表現強勢天域半導體（02658）升逾11% 兩部發布產業規劃半導體設備景氣度向好

快訊：科創50指數升逾1% 半導體設備板塊震盪反彈

多隻科創半導體ETF升逾3%

半導體設備板塊持續拉升，華海清科升逾10%

半導體設備板塊震盪反彈臻寶科技升逾10%

兩部門：提升人工智能芯片設計水平

兩部門：提升人工智能芯片設計水平

兩部門：提升人工智能芯片設計水平

ETF資金流|資金淨流出創新藥ETF、港股通創新藥ETF、化工ETF、半導體設備ETF等

據兩名知情人士透露，美國司法部正在調查英偉達(NVDA.US)是否試圖規避反壟斷審查，以達成去年與人工智能芯片製造商Gr

13個漲停！存儲擴產攪動半導體設備，有公司淨利增1324%

機構：2026年第二季晶圓代工營收接近534.9億美元先進製程與AI需求持續強勁

機構：2Q26晶圓代工營收接近534.9億美元，先進製程與AI需求持續強勁

機構：2Q26晶圓代工營收接近534.9億美元，先進製程與AI需求持續強勁

【券商聚焦】中信建投：看好半導體設備下半年創新高

中信建投：存儲IPO繼續推動，看好半導體設備下半年創新高

英特爾晶圓代工與阿斯麥深化合作，推動High-NA EUV用於更大尺寸AI芯片

TradingKey中文

芯片需求拉動韓國對印度出口增幅超30%

环球市场播报

芯片需求拉動韓國對印度出口增幅超30%

據華爾街日報報道，參與談判的知情人士稱，美國談判代表利用獲得英偉達(NVDA.US)人工智能芯片的承諾，幫助促成去年亞美

{"basename":"/hant","ssrTDKData":{"titleTemplate":"%s - 老虎證券","title":"Easy breezy. No more feesies.","description":"Tiger Trade is a mobile trading app offering real time data, low commission fees and a free demo account. Download now to start investing in ETFs, options and the global share market.","keywords":"老虎國際,美股交易,港股交易,交易美股,股票信息,股價,美股行情,美股打新,港股打新,IPO打新,購買美股,全球投資","social":{"ogDescription":"Tiger Trade is a mobile trading app offering real time data, low commission fees and a free demo account. Download now to start investing in ETFs, options and the global share market.","ogImage":"https://c1.itigergrowtha.com/portal5/static/media/og-logo.0a0bd8dc.png","ogUrl":"https://www.thetigerbrokers.com/hant/stock/SOXM/news"},"companyName":"老虎證券"},"pageData":{"isMobile":false,"isTiger":false,"isTTM":true,"region":"NZL","license":"TBKIWI","edition":"fundamental","symbol":"SOXM","isAnalysisPage":false},"__swrFallback__":{"@#url:\"https://hq.skytigris.cn/stock_info/detail/global\",params:#delay:false,,method:\"POST\",data:#items:@#symbol:\"SOXM\",,,,,undefined,":{"symbol":"SOXM","market":"US","secType":"STK","nameCN":"Tradr 2X Long SOXX Monthly ETF","latestPrice":22.36,"timestamp":1789588800000,"preClose":22.36,"halted":0,"volume":0,"delay":0,"changeRate":0,"floatShares":85000,"shares":85000,"eps":0,"marketStatus":"未開盤","change":0,"latestTime":"09-16 16:00:00 EDT","open":22.36,"high":22.36,"low":22.36,"amount":0,"amplitude":0,"askPrice":0,"askSize":0,"bidPrice":0,"bidSize":0,"shortable":3,"etf":2,"ttmEps":0,"tradingStatus":0,"nextMarketStatus":{"tag":"盤前交易","tradingStatus":1,"beginTime":1789632000000},"marketStatusCode":0,"adr":0,"exchange":"NASDAQ","adjPreClose":22.36,"sharesOutstanding":85000,"nav":22.4149,"aum":1905270.64,"bidAskSpread":0,"volumeRatio":0,"impliedVol":0.1816,"impliedVolPercentile":0},"@#url:\"https://hq.skytigris.cn/stock_info/fundamental/all\",params:#delay:false,,method:\"POST\",data:#items:@#symbol:\"SOXM\",,,,,undefined,":{"symbol":"SOXM","floatShares":85000,"roa":"--","roe":"--","lyrEps":0,"shares":85000,"dividePrice":0,"high":22.36,"amplitude":0,"preClose":22.36,"low":22.36,"week52Low":22.36,"pbRate":"--","week52High":22.36,"institutionHeld":0,"latestPrice":22.36,"eps":0,"divideRate":0,"volume":0,"delay":0,"ttmEps":0,"open":22.36,"prevYearClose":22.36,"prevWeekClose":22.36,"prevMonthClose":22.36,"prevQuarterClose":22.36,"fiveDayClose":22.36,"twentyDayClose":22.36,"sixtyDayClose":22.36},"@#url:\"https://hq.skytigris.cn/fundamental/corporate_actions/details/SOXM\",params:#limit:5,,,undefined,":[{"market":"US","date":"2025-02-24","symbol":"SOXM","reason":null,"defaultRemindTime":1740407400000,"announcedDate":"2025-02-21","type":"delisting","dateTimestamp":1740373200000}],"@#url:\"https://hq.skytigris.cn/fundamental/dividend/history\",params:#symbol:\"SOXM\",market:\"US\",,,undefined,":[],"@#url:\"https://hq.skytigris.cn/fundamental/estimate/recommendation\",params:#symbol:\"SOXM\",market:\"US\",delay:false,,,undefined,":{},"$inf$@#url:\"https://stock-news.skytigris.cn/v2/news/list\",params:#symbols:\"SOXM\",pageSize:20,pageCount:1,lang_content:\"cn\",edition:\"fundamental\",,,undefined,":[{"items":[{"id":"2667671370","title":"半導體板塊表現強勢 天域半導體（02658）升逾11% 兩部發布產業規劃 半導體設備景氣度向好","url":"https://stock-news.laohu8.com/highlight/detail?id=2667671370","media":"金吾财讯","labels":["dataReport"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2667671370?lang=zh_tw&edition=fundamental","pubTime":"2026-09-16 11:01","pubTimestamp":1789527672,"startTime":"0","endTime":"0","summary":"金吾财讯 | 港股半导体板块表现强势，截至发稿，天域半导体 涨11.68%，天利控股集团涨6.94%，天岳先进涨6.41%，华虹宏力涨4.35%，基本半导体涨3.17%，英诺赛科涨2.52%。消息面上，工业和信息化部、国家发展改革委近日联合印发《电子信息制造业发展“十五五”规划》。方正证券认为，AI发展促使晶圆厂建设、产线改造和设备更新保持持续投入，半导体设备仍是未来几年高景气方向。","market":"us","thumbnail":"https://static.szfiu.com/news/20250110/MDc3ODQ0ZjRmZjY3NDY3NWE2ZmExZWEzMjkyYmRjMmI4NjI3MTMyNDA2NzU1.jpg","type":0,"news_type":0,"thumbnails":["https://static.szfiu.com/news/20250110/MDc3ODQ0ZjRmZjY3NDY3NWE2ZmExZWEzMjkyYmRjMmI4NjI3MTMyNDA2NzU1.jpg"],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"299f0a9977df499f8ead781071e5e5e7","theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"1991732","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"dataReport","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["CHPX","NJUL","SHOC","XT","SOXM","THMZ","GINN","LRCC","KSTR","AMAU","PSCT","SOXW","XSEM","TCHI","INVN","AIO","SMHC","WISE","01347","PQNT","LRNZ","QQJG","FRWD","02658","INT","BCTK","02631","THNQ","TQQY","XITK","TSMU","YNOT","02577","ASMG","LOUP","WDAI","AIS","TEKY","TTXD","INTW","ASMZ","PSAI","00117","GTEK","ALAI","TWSC","09971","QLD","IQM","NVDK"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2667761820","title":"快訊：科創50指數升逾1% 半導體設備板塊震盪反彈","url":"https://stock-news.laohu8.com/highlight/detail?id=2667761820","media":"中金财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2667761820?lang=zh_tw&edition=fundamental","pubTime":"2026-09-15 11:05","pubTimestamp":1789441503,"startTime":"0","endTime":"0","summary":"　　9月15日消息，指数探底回升，深成指、创指翻红，科创50指数涨超1%。　　盘面上，半导体设备板块盘中震荡反弹，臻宝科技涨超10%；PCB概念反复活跃，华正新材7天3板，澳弘电子涨停；煤炭板块表现活跃，云煤能源触及涨停；MLCC概念震荡拉升，双星新材3连板。下跌方面，旅游板块震荡下挫，天目湖、桂林旅游跌停；农业板块再度调整，新农开发二连跌停；培育钻石板块回调，恒林股份领跌。","market":"sh","thumbnail":" http://caiji.3g.cnfol.com/colect/202609/15/20260915518802.jpg","type":0,"news_type":0,"thumbnails":[" http://caiji.3g.cnfol.com/colect/202609/15/20260915518802.jpg"],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://sc.stock.cnfol.com/shichangceping/20260915/32369861.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"zhongjincaijing_highlight","symbols":["ASMU","XITK","LOUP","SHOC","GINN","ALAI","INT","GTEK","KSTR","QQJG","SOXM","STSM","YNOT","BCTK","PSCT","SMHC","IQM","XT","LRNZ","PSAI","THNQ","WISE","AIO","INTW","SOXW","TSMZ","TWSC","TSMY","XSEM","TSMX","APMI","THMZ","CHPX","FRWD","INVN","AMAU","ASMZ","LRCU","AMA","TSMG","TSMU","INYY","AIS","ASMG","PQNT","LRCC","159371","TEKY","WDAI","LINT"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2667690256","title":"多隻科創半導體ETF升逾3%","url":"https://stock-news.laohu8.com/highlight/detail?id=2667690256","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2667690256?lang=zh_tw&edition=fundamental","pubTime":"2026-09-15 10:22","pubTimestamp":1789438977,"startTime":"0","endTime":"0","summary":null,"market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.zhitongcaijing.com/immediately.html?type=usstock","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_zhitongcaijing","symbols":["SMHC","YNOT","QQJG","FRWD","STSM","TSMY","THNQ","CHPX","AIO","INTW","XT","WISE","AMA","GTEK","KSTR","LOUP","TSMZ","PSCT","LRNZ","INYY","WDAI","ASMZ","SOXM","XITK","TSMG","ALAI","FDN","BCTK","TSMX","INT","AIS","APMI","PQNT","TWSC","IQM","AMAU","SOXW","LINT","ASMG","TEKY","THMZ","LRCC","ASMU","GINN","LRCU","PSAI","TSMU","XSEM","INVN","SHOC"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2667901786","title":"半導體設備板塊持續拉升，華海清科升逾10%","url":"https://stock-news.laohu8.com/highlight/detail?id=2667901786","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2667901786?lang=zh_tw&edition=fundamental","pubTime":"2026-09-15 10:18","pubTimestamp":1789438710,"startTime":"0","endTime":"0","summary":null,"market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.zhitongcaijing.com/immediately.html?type=usstock","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_zhitongcaijing","symbols":["AMAU","SHOC","ASMZ","CHPX","INT","BK4138","XSEM","WISE","SOXW","TEKY","FRWD","BCTK","TWSC","ASMG","LRCC","STSM","AIO","THNQ","TSMU","TSMX","TSMY","GINN","XT","PSCT","INVN","INTW","TSMZ","WDAI","IQM","AMA","APMI","LRCU","PQNT","SMHC","YNOT","GTEK","XITK","LRNZ","ASMU","PSAI","QQJG","SOXM","LOUP","ALAI","TSMG","KSTR","THMZ","LINT","AIS","INYY"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2667903606","title":"半導體設備板塊震盪反彈 臻寶科技升逾10%","url":"https://stock-news.laohu8.com/highlight/detail?id=2667903606","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2667903606?lang=zh_tw&edition=fundamental","pubTime":"2026-09-15 10:00","pubTimestamp":1789437604,"startTime":"0","endTime":"0","summary":null,"market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.zhitongcaijing.com/immediately.html?type=usstock","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_zhitongcaijing","symbols":["ASMU","XITK","LOUP","SHOC","GINN","ALAI","INT","GTEK","KSTR","QQJG","SOXM","STSM","YNOT","BCTK","PSCT","SMHC","IQM","XT","LRNZ","PSAI","THNQ","WISE","AIO","INTW","SOXW","TSMZ","TWSC","TSMY","XSEM","TSMX","APMI","THMZ","CHPX","FRWD","INVN","AMAU","ASMZ","LRCU","AMA","TSMG","TSMU","INYY","AIS","ASMG","PQNT","LRCC","BK4138","TEKY","WDAI","LINT"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2667697310","title":"兩部門：提升人工智能芯片設計水平","url":"https://stock-news.laohu8.com/highlight/detail?id=2667697310","media":"格隆汇","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2667697310?lang=zh_tw&edition=fundamental","pubTime":"2026-09-15 09:21","pubTimestamp":1789435260,"startTime":"0","endTime":"0","summary":null,"market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.gelonghui.com/rss/live/live.xml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_gelonghui","symbols":["ONG","AMDL","FTEC","AVL","ARMG","BAI","AMDG","NVDX","SEMI","AMUU","XIGV","GFSG","KSTR","INYY","TSXD","NVDU","TSMG","TSXU","NVDK","SOXM","NVIT","QQQM","DIPS","AMDC","NVDL","TCHI","AMDY","AIYY","SPTE","IXN","NVDW","SHOC","IYW","TSMZ","MUU","CHPX","XSEM","SOXW","TSMX","SMHC","NVDG","SEMY","INT","ARMH","NVC","TSMY","TWSC","AMDD","BCTK","ARMA"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2667638697","title":"兩部門：提升人工智能芯片設計水平","url":"https://stock-news.laohu8.com/highlight/detail?id=2667638697","media":"格隆汇APP","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2667638697?lang=zh_tw&edition=fundamental","pubTime":"2026-09-15 09:21","pubTimestamp":1789435260,"startTime":"0","endTime":"0","summary":"格隆汇9月15日｜工业和信息化部、国家发展改革委印发《电子信息制造业发展“十五五”规划》。其中提到，提升人工智能芯片设计水平，加强张量核心数据流组织、混合精度、动态稀疏计算、统一内存架构等技术攻关创新。聚焦低延迟、高吞吐、低功耗等核心性能指标，提高通用图形处理器(GPGPU)、专用集成电路(ASIC)、SoC等处理器综合计算能力，布局软硬耦合推理芯片等新路线。","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://finance.sina.com.cn/stock/bxjj/2026-09-15/doc-inirwfqe6997242.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"sina","symbols":["XIGV","NVDL","TWSC","ARMG","TSXD","NVDX","SOXM","AMDD","GFSG","BAI","CHPX","NVDU","SHOC","NVDK","TSMG","TSXU","BCTK","TSMX","ARMH","INT","NVIT","NVC","DIPS","QQQM","KSTR","IXN","FTEC","IYW","SEMY","SOXW","INYY","AMDL","AMDC","AVL","SMHC","NVDG","ARMA","XSEM","TCHI","MUU","AIYY","NVDW","TSMZ","SPTE","ONG","SEMI","TSMY","AMDY","AMDG","AMUU"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2667340697","title":"兩部門：提升人工智能芯片設計水平","url":"https://stock-news.laohu8.com/highlight/detail?id=2667340697","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2667340697?lang=zh_tw&edition=fundamental","pubTime":"2026-09-15 09:20","pubTimestamp":1789435249,"startTime":"0","endTime":"0","summary":null,"market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.zhitongcaijing.com/immediately.html?type=usstock","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_zhitongcaijing","symbols":["MUU","BCTK","DIPS","INT","SOXM","XIGV","NVDG","SPTE","AMUU","SEMI","SMHC","NVDY","TSMY","KSTR","TCHI","IXN","NVC","SOXW","TSXD","NVIT","NVDL","SHOC","TSMG","SEMY","AMDG","TSMZ","NVDU","ONG","XSEM","AMDL","NVDW","INYY","AMDC","AMDD","ARMA","TSMX","AMDY","GFSG","NVDK","CHPX","TWSC","ARMH","BAI","QQQM","AVL","AIYY","NVDX","IYW","NYYY","TSXU"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2667639340","title":"ETF資金流|資金淨流出創新藥ETF、港股通創新藥ETF、化工ETF、半導體設備ETF等","url":"https://stock-news.laohu8.com/highlight/detail?id=2667639340","media":"格隆汇","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2667639340?lang=zh_tw&edition=fundamental","pubTime":"2026-09-14 09:11","pubTimestamp":1789348318,"startTime":"0","endTime":"0","summary":null,"market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.gelonghui.com/rss/live/live.xml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_gelonghui","symbols":["BCTK","AIO","PQNT","XITK","LRCC","CHPX","LOUP","SMHC","TWSC","GINN","SOXW","TSMZ","SOXM","AMA","IQM","XSEM","159316","THMZ","FRWD","FDN","PSCT","INT","APMI","ASMU","FLHK","AMAU","STSM","LRCU","WISE","XT","ASMZ","INVN","TSMG","TSMX","INTW","YNOT","ASMG","KSTR","GTEK","ALAI","AIS","QQJG","PSAI","SHOC","WDAI","THNQ","LRNZ","159870","LINT","TEKY"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2666155687","title":"據兩名知情人士透露，美國司法部正在調查英偉達(NVDA.US)是否試圖規避反壟斷審查，以達成去年與人工智能芯片製造商Gr","url":"https://stock-news.laohu8.com/highlight/detail?id=2666155687","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2666155687?lang=zh_tw&edition=fundamental","pubTime":"2026-09-10 08:34","pubTimestamp":1789000489,"startTime":"0","endTime":"0","summary":null,"market":"uk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.zhitongcaijing.com/immediately.html?type=usstock","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_zhitongcaijing","symbols":["AIYY","NVIT","HCA","EVNT","BWEB","ARMG","JHCS","TDAQ","DIPS","SHOC","NVDL","NBCC","NVDK","KSTR","NVDU","GFSG","NVDY","NVDG","ONG","IXN","SOXM","GOOX","AVL","JHMT","DISC","MSFX","CHPX","NVDW","QQQM","MSFY","SEMY","TSMG","TSMX","BUYO","GXPC","WEBL","SPTE","AMDG","FCOM","NVDX","SMHC","TSXU","FTEC","TGRW","NVC","WEBX","AMDY","ARB","BCTK","ARMH"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2666586096","title":"13個漲停！存儲擴產攪動半導體設備，有公司淨利增1324%","url":"https://stock-news.laohu8.com/highlight/detail?id=2666586096","media":"中金财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2666586096?lang=zh_tw&edition=fundamental","pubTime":"2026-09-09 16:55","pubTimestamp":1788944121,"startTime":"0","endTime":"0","summary":"2026年上半年，北方华创、中微公司、拓荆科技三大半导体行业龙头的营收、利润均实现不同程度增长，其中拓荆科技归母净利润同比增速高达1324%，领跑行业。　　全球存储产能持续扩张、半导体设备行业高景气度持续升温，叠加国产替代进程加速，A股半导体设备板块行情与基本面持续向好。在此行业背景下，传统家居企业爱丽家居跨界布局半导体设备赛道的并购动作，引发资本市场强烈追捧，自7月21日至9月1日，其累计斩获13个涨停。","market":"fut","thumbnail":" http://caiji.3g.cnfol.com/colect/202609/09/20260909458556.jpeg","type":0,"news_type":0,"thumbnails":[" http://caiji.3g.cnfol.com/colect/202609/09/20260909458556.jpeg"],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://sc.stock.cnfol.com/shichangjuejin/20260909/32364855.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"zhongjincaijing_highlight","symbols":["FRWD","APMI","IQM","INTW","AIO","THNQ","LINT","AMAU","TSMY","PQNT","KSTR","QQJG","SHOC","YNOT","TSMX","INVN","STSM","TWSC","TSMZ","SMHC","TEKY","XITK","PSCT","TSMG","ASMZ","BK4138","GTEK","INT","XT","ALAI","SOXM","WISE","ASMU","LOUP","THMZ","LRCC","PSAI","WDAI","XSEM","LRNZ","GINN","ASMG","AMA","SOXW","TSMU","BCTK","INYY","AIS","LRCU","CHPX"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2666880605","title":"機構：2026年第二季晶圓代工營收接近534.9億美元 先進製程與AI需求持續強勁","url":"https://stock-news.laohu8.com/highlight/detail?id=2666880605","media":"格隆汇","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2666880605?lang=zh_tw&edition=fundamental","pubTime":"2026-09-09 15:31","pubTimestamp":1788939103,"startTime":"0","endTime":"0","summary":null,"market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.gelonghui.com/rss/live/live.xml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_gelonghui","symbols":["ARTY","CHAT","ARMH","ASMU","CHPX","SHOC","SOXM","UMCU","NVDS","AMAU","VTHR","GFSG","AMDW","XSEM","SEMY","AGIX","AMDL","AMUU","ASMG","TSMY","NVDL","AMDG","UMCX","DAMD","NVII","TSMX","AIPO","KSTR","TSMZ","NVDO","QTOC","LRCC","NVD","TSMG","AMDC","SMHC","TSMU","TSXU","EUVX","INTW","TWSC","SEMI","NVDW","ASMZ","LINT","TSEU","NVDB","INT","TMYY","TSEG"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2666588936","title":"機構：2Q26晶圓代工營收接近534.9億美元，先進製程與AI需求持續強勁","url":"https://stock-news.laohu8.com/highlight/detail?id=2666588936","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2666588936?lang=zh_tw&edition=fundamental","pubTime":"2026-09-09 15:24","pubTimestamp":1788938670,"startTime":"0","endTime":"0","summary":null,"market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.zhitongcaijing.com/immediately.html?type=usstock","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_zhitongcaijing","symbols":["TSMZ","VTHR","ANV","AMDL","XSEM","AMAU","SEMI","TWSC","NVDO","CHAT","ASMU","AIPO","TSEG","SHOC","NVDL","AGIX","NVYY","TSMY","KSTR","TMYY","GFSG","SOXM","APMI","STSM","NVDQ","SEMY","CHPX","TSMX","TSMG","QTOC","DAMD","LRCC","AMDG","ARTY","AMUU","ASMG","INYY","ASMZ","TSEU","TSMU","UMCX","SMHC","TSXU","INTW","AMYY","EUVX","AMDY","AMDC","INT","ARMH"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2666588980","title":"機構：2Q26晶圓代工營收接近534.9億美元，先進製程與AI需求持續強勁","url":"https://stock-news.laohu8.com/highlight/detail?id=2666588980","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2666588980?lang=zh_tw&edition=fundamental","pubTime":"2026-09-09 15:24","pubTimestamp":1788938642,"startTime":"0","endTime":"0","summary":null,"market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.zhitongcaijing.com/immediately.html?type=usstock","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_zhitongcaijing","symbols":["NVDU","UMCX","SEMY","INYY","TSEG","LRCU","GFSG","AGIX","NVDY","ASMU","AMUU","CHPX","CHAT","TSXU","AIPO","SHOC","TSMU","TSMG","XSEM","AMYY","EUVX","ARMH","NVDS","LINT","NVDO","TSMX","AMDL","TSMY","NVDL","SOXM","ASMZ","TMYY","TSMZ","ARTY","TWSC","KSTR","NVDW","INTW","AMAU","ASMG","SEMI","QTOC","TSEU","DIPS","AMDG","INT","LRCC","SMHC","VTHR","AMDC"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2666442305","title":"【券商聚焦】中信建投：看好半導體設備下半年創新高","url":"https://stock-news.laohu8.com/highlight/detail?id=2666442305","media":"金吾财讯","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2666442305?lang=zh_tw&edition=fundamental","pubTime":"2026-09-09 08:54","pubTimestamp":1788915298,"startTime":"0","endTime":"0","summary":"金吾财讯 | 中信建投证券研究指，（1）人形机器人：海内外催化不断，建议聚焦优质环节。（2）AIDC发电设备：全球燃机订单高景气延续，AIDC燃气发电项目建设同比高增。（3）工程机械：7月挖机内外销继续共振向上，板块将迎来逐季度改善。（4）半导体设备：存储IPO继续推动，看好半导体设备下半年创新高。（5）锂电设备：固态量产时间表收敛，装备环节兑现拐点确立。","market":"sh","thumbnail":"https://static.szfiu.com/news/20250109/YmQzNzBkZGZmOTg1MzM5MTQzMTA0Ng==.jpg","type":0,"news_type":0,"thumbnails":["https://static.szfiu.com/news/20250109/YmQzNzBkZGZmOTg1MzM5MTQzMTA0Ng==.jpg"],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"1991082","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["AIS","XT","ASMZ","TEKY","GTEK","SOXW","INT","INVN","SOXM","02252","TWSC","AMAU","ASMG","WISE","09660","09880","KSTR","PSCT","LOUP","WDAI","AIO","MIUmain","PQNT","SHOC","XITK","QQJG","LRCC","BCTK","KCE","ALAI","PSAI","02590","01810","XSEM","YNOT","SMHC","02498","IQM","THNQ","CHPX","81810","FRWD","06682","THMZ","601066","HXXD.SI","GINN","09868","LRNZ"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2666033813","title":"中信建投：存儲IPO繼續推動，看好半導體設備下半年創新高","url":"https://stock-news.laohu8.com/highlight/detail?id=2666033813","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2666033813?lang=zh_tw&edition=fundamental","pubTime":"2026-09-09 07:46","pubTimestamp":1788911164,"startTime":"0","endTime":"0","summary":null,"market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.zhitongcaijing.com/immediately.html?type=usstock","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_zhitongcaijing","symbols":["YNOT","REDS","THMZ","AMAU","FRWD","GTEK","TSMG","IPOS","TSMX","PSCT","GINN","AIO","INT","KSTR","SOXW","LOUP","AIS","KCE","TEKY","IQM","ASMZ","SOXM","TSMU","ALAI","APMI","STSM","BCTK","XSEM","LRCU","TSMY","LRNZ","TWSC","SMHC","ASMU","WISE","XITK","LRCC","INVN","PQNT","WDAI","FRHC","LINT","XT","THNQ","QQJG","SHOC","CHPX","TSMZ","PSAI","ASMG"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2665546328","title":"英特爾晶圓代工與阿斯麥深化合作，推動High-NA EUV用於更大尺寸AI芯片","url":"https://stock-news.laohu8.com/highlight/detail?id=2665546328","media":"TradingKey中文","labels":["corporation"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2665546328?lang=zh_tw&edition=fundamental","pubTime":"2026-09-08 15:03","pubTimestamp":1788851034,"startTime":"0","endTime":"0","summary":"TradingKey - 英特尔（INTC）晶圆代工业务正与阿斯麦（ASML）进一步深化High-NA EUV合作。阿斯麦最新表示，将与包括英特尔、英伟达（NVDA）、台积电（TSM）和三星电子在内的主要芯片企业合作，开发更大尺寸光掩模，以推动下一代High-NA EUV设备用于大型AI和数据中心芯片制造。","market":"sg","thumbnail":"https://resource.tradingkey.com/cms_uploads/img/20240102/c0531811fe341e7a5268ef210c462723.jpg","type":0,"news_type":0,"thumbnails":["https://resource.tradingkey.com/cms_uploads/img/20240102/c0531811fe341e7a5268ef210c462723.jpg"],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.tradingkey.com/zh-hans/analysis/stocks/us-stock/262155438-intel-foundry-asml-deepen-collaboration-promote-high-na-euv-larger-ai-chips-tradingkey","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"corporation","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["AMDL","BGIA","CNAV","TSMU","03191","SEMY","AMUU","AMDG","XSEM","TSMY","TWSC","QQQA","AIS","SOXM","SMHC","SHOC","TSMX","TSMZ","INTC","AVGC","LRNZ","SINTCmain","CHPX","AIVC","TMYY","GPTZ","TSMG","ARMH","AIBU","AMDC","WISE","LINT","UMCX","INTW","EUV","TSEU","LEGR","TSXU","AVGX","AIQ","TSEG","FTXL","TTEQ","INT","XNTK","FAI","ALAI","AIFD","GFSG","EPAI"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2665395807","title":"芯片需求拉動韓國對印度出口增幅超30%","url":"https://stock-news.laohu8.com/highlight/detail?id=2665395807","media":"环球市场播报","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2665395807?lang=zh_tw&edition=fundamental","pubTime":"2026-09-07 10:19","pubTimestamp":1788747540,"startTime":"0","endTime":"0","summary":"韩国官方机构周一表示，受半导体旺盛需求带动，今年1‑8月韩国对印度出口额较2025年同期大涨超30%。韩国贸易投资振兴公社（KOTRA）数据显示，1‑8月韩国对印度出口同比增长30.8%，达到168亿美元，去年同期为128.4亿美元。在印度工业化推进背景下，韩国半导体企业以及材料、零部件、设备厂商不断扩大在印度市场布局。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://finance.sina.com.cn/stock/usstock/c/2026-09-07/doc-iniqyeue6457871.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"sina","symbols":["TTXU","SOXM","MNDmain"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2665395870","title":"芯片需求拉動韓國對印度出口增幅超30%","url":"https://stock-news.laohu8.com/highlight/detail?id=2665395870","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2665395870?lang=zh_tw&edition=fundamental","pubTime":"2026-09-07 10:18","pubTimestamp":1788747507,"startTime":"0","endTime":"0","summary":null,"market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.zhitongcaijing.com/immediately.html?type=usstock","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_zhitongcaijing","symbols":["TTXU","SOXM"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2665357622","title":"據華爾街日報報道，參與談判的知情人士稱，美國談判代表利用獲得英偉達(NVDA.US)人工智能芯片的承諾，幫助促成去年亞美","url":"https://stock-news.laohu8.com/highlight/detail?id=2665357622","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2665357622?lang=zh_tw&edition=fundamental","pubTime":"2026-09-05 08:54","pubTimestamp":1788569644,"startTime":"0","endTime":"0","summary":null,"market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.zhitongcaijing.com/immediately.html?type=usstock","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_zhitongcaijing","symbols":["NVDX","CHPX","ARMA","SOXW","NVIT","TSXU","AMDY","TCHI","AIYY","GFSG","SEMY","TSMZ","NVDU","TWSC","NVDW","SMHC","KSTR","MUU","SEMI","TSMG","AMDG","ARMH","AVL","XIGV","NVDY","INYY","ONG","NYYY","QQQM","NVDK","NVDG","XSEM","TSMY","NVDA","AMDL","BAI","BCTK","TSMX","FTEC","NVC","ARMG","SHOC","AMDD","NVDL","DIPS","INT","IXN","SPTE","AMDC","SOXM"],"isVideo":false,"video":null,"gpt_icon":0}],"pageSize":20,"totalPage":10,"pageCount":1,"totalSize":200,"code":"91000000","status":"200"}]}}